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Total Products: 236,805
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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LPC1825JET100E
LPC1825JET100ENXP SemiconductorsIC MCU 32BIT 768KB FLSH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Size:
768KB (768K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
849
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LPC1827JBD144E
LPC1827JBD144ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
589
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LPC1827JET100E
LPC1827JET100ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
313
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LPC1830FBD144,551
LPC1830FBD144,551NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
375
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LPC1830FBD144K
LPC1830FBD144KNXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,168
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LPC1830FET100,551
LPC1830FET100,551NXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
793
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LPC1830FET100Y
LPC1830FET100YNXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
937
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LPC1830FET180,551
LPC1830FET180,551NXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
118
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
208
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N/AN/ALPC1830FET256NXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10bSAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
569
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LPC1830FET256,551
LPC1830FET256,551NXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
304
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N/A
LPC1830FET256KNXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
599
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LPC1833FET256,551
LPC1833FET256,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
896
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LPC1833JBD144E
LPC1833JBD144ENXP SemiconductorsIC MCU 32BIT 512KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
562
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LPC1833JET100E
LPC1833JET100ENXP SemiconductorsIC MCU 32BIT 512KB FLSH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
84
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LPC1833JET256,551
LPC1833JET256,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
436
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LPC1837FET256,551
LPC1837FET256,551NXP SemiconductorsIC MCU 32BIT 1MB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
253
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LPC1837JBD144E
LPC1837JBD144ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
110
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LPC1837JET100E
LPC1837JET100ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
955
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LPC1837JET256,551
LPC1837JET256,551NXP SemiconductorsIC MCU 32BIT 1MB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
985
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LPC1850FBD208,551
LPC1850FBD208,551NXP SemiconductorsIC MCU 32BIT ROMLESS 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
142
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,448
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