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Total Products: 236,805
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Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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LPC1850FET180,551
LPC1850FET180,551NXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
118
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
873
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LPC1850FET256,551
LPC1850FET256,551NXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
1,169
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LPC1853FET256,551
LPC1853FET256,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
150MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
80
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
1,136
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LPC1853JBD208E
LPC1853JBD208ENXP SemiconductorsIC MCU 32BIT 512KB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
142
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,472
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LPC1853JET256,551
LPC1853JET256,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
895
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LPC1857FET256,551
LPC1857FET256,551NXP SemiconductorsIC MCU 32BIT 1MB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
919
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LPC1857JBD208E
LPC1857JBD208ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
142
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,664
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LPC1857JET256,551
LPC1857JET256,551NXP SemiconductorsIC MCU 32BIT 1MB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
668
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LPC18S10FBD144E
LPC18S10FBD144ENXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
88
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LPC18S10FET100E
LPC18S10FET100ENXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
497
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LPC18S10FET180EN/ALPC18S10FET180ENXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
501
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LPC18S30FBD144EN/ALPC18S30FBD144ENXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
155
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LPC18S30FET100EN/ALPC18S30FET100ENXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
1,059
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LPC18S30FET256E
LPC18S30FET256ENXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
813
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LPC18S37JBD144EN/ALPC18S37JBD144ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
428
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LPC18S37JET100E
LPC18S37JET100ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
927
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LPC18S50FET180E
LPC18S50FET180ENXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
118
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,572
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LPC18S50FET256,551
LPC18S50FET256,551NXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
292
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LPC18S57JBD208EN/ALPC18S57JBD208ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
142
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
219
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LPC18S57JET256E
LPC18S57JET256ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
180MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
637
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