| N/A | | M55D4G16256A-CDBG2R | ESMT | 4Gb LPDDR3 SDRAM | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -25°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Organization: 256M x 16 Memory Interface: Parallel | 157 | |
| N/A | | M55D4G16256A-EEBG2R | ESMT | 4Gb LPDDR3 SDRAM | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -25°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Organization: 256M x 16 Memory Interface: Parallel | 693 | |
| N/A | | M55D4G16256A-GFBG2R | ESMT | 4Gb LPDDR3 SDRAM | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -25°C – 85°C | Clock Frequency: 1.066 GHz Write Cycle Time Word Page: 15 ns Memory Organization: 256M x 16 Memory Interface: Parallel | 907 | |
| N/A | | M55D4G32128A (2R) | ESMT | 4Gb LPDDR3 SDRAM Ind. | DRAM Memory | 178 Ball BGA | 1.8V / 1.2V | -40°C – 85°C | Clock Frequency: 1.066 GHz Write Cycle Time Word Page: 15 ns Memory Organization: 128M x 32 | 716 | |
| N/A | | M55D4G32128A-CDBG2R | ESMT | 4Gb LPDDR3 SDRAM | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -25°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Organization: 128M x 32 Memory Interface: Parallel | 31 | |
| N/A | | M55D4G32128A-CDBIG2R | ESMT | 4Gb LPDDR3 SDRAM Ind. | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -40°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Organization: 128M x 32 Memory Interface: Parallel | 1,377 | |
| N/A | | M55D4G32128A-EEBG2R | ESMT | 4Gb LPDDR3 SDRAM | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -25°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Organization: 128M x 32 Memory Interface: Parallel | 87 | |
| N/A | | M55D4G32128A-EEBIG2R | ESMT | 4Gb LPDDR3 SDRAM Ind. | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -40°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Organization: 128M x 32 Memory Interface: Parallel | 52 | |
| N/A | | M55D4G32128A-GFBG2R | ESMT | 4Gb LPDDR3 SDRAM | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -25°C – 85°C | Clock Frequency: 1.066 GHz Write Cycle Time Word Page: 15 ns Memory Organization: 128M x 32 Memory Interface: Parallel | 344 | |
| N/A | | M55D4G32128A-GFBIG2R | ESMT | 4Gb LPDDR3 SDRAM Ind. | DRAM Memory | 178-BGA (10x11.5) | 1.14V ~ 1.30V, 1.70V ~ 1.95V | -40°C – 85°C | Clock Frequency: 1.066 GHz Write Cycle Time Word Page: 15 ns Memory Organization: 128M x 32 Memory Interface: Parallel | 1,505 | |
| N/A | | M56Z4G16256A (2H) | ESMT | 4Gb LPDDR4x SDRAM Ind. | DRAM Memory | 200 Ball BGA | 1.7V ~ 1.95V | -40°C – 85°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 18 ns Technology: DRAM - LPDDR4X Memory Organization: 256M x 16 | 425 | |
| N/A | | M56Z4G16256A2H | ESMT | 4Gb LPDDR4x SDRAM | DRAM Memory | 200 Ball BGA | 1.70V ~ 1.95V | -25°C – 85°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 18 ns Technology: DRAM - LPDDR4X Memory Organization: 256M x 16 | 1,523 | |
| N/A | N/A | M56Z8G16512A (2H) | ESMT | 8Gb LPDDR4x SDRAM Ind. | DRAM Memory | 200 Ball BGA | 2.5V | -40°C – 85°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 18 ns Memory Organization: 512M x 16 Memory Interface: Parallel | 814 | |
| N/A | | M56Z8G32256A | ESMT | 8Gb LPDDR4x SDRAM | DRAM Memory | 200 Ball BGA | 1.70V ~ 1.95V | -25°C – 85°C | Clock Frequency: 1.866 GHz Write Cycle Time Word Page: 18 ns Technology: DRAM - LPDDR4X Memory Organization: 256M x 32 | 411 | |
| N/A | | M56Z8G32256A (2H) | ESMT | 8Gb LPDDR4x SDRAM | DRAM Memory | 200 Ball BGA | 1.70V ~ 1.95V | -25°C – 85°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 18 ns Technology: DRAM - LPDDR4X Memory Organization: 256M x 32 | 887 | |
 | N/A | M62371GP#RF0J | Renesas | 8-BIT 36-CH SW BUILT-IN DAC | Microcontrollers | N/A | N/A | N/A | N/A | 231 | |
| N/A | | M66591GP#RB1S | Renesas | MCU LQFP | Microcontrollers | N/A | N/A | N/A | N/A | 1,611 | |
 | | M68LC302CAF16VCT | NXP Semiconductors | IC MPU M683XX 166MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 368 | |
 | | M68LC302CAF20VCT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 247 | |
 | | M68LC302CPU16VCT | NXP Semiconductors | IC MPU M683XX 166MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 720 | |