| N/A | | 88W8897PB1-NXVA/BZ | NXP Semiconductors | 2X2 11AC DUAL-BAND + BT4.0 + NFC | RF Transceiver ICs | N/A | N/A | N/A | N/A | 129 | |
| N/A | | 88W8964-B0-BTWC/AK | NXP Semiconductors | 4X4 802.11AC WAVE2 WIFI WITH BF | RF Transceiver ICs | - | - | – | | 1,317 | |
| N/A | | 88W8964-B0-BTWC/AZ | NXP Semiconductors | 4X4 802.11AC WAVE2 WIFI WITH BF | RF Transceiver ICs | - | - | – | | 1,513 | |
| N/A | | 88W8964-B0-BTWI/AK | NXP Semiconductors | 4X4 802.11AC WAVE2 WIFI WITH BF | RF Transceiver ICs | - | - | – | | 417 | |
| N/A | | 88W8977-A1-EADE/AZ | NXP Semiconductors | 1X1 11N DUAL BAND + BT IN T&R (E | RF Transceiver ICs | 74-eWLP (3.46x4.68) | 1.05V, 1.8V, 2.2V | -30°C ~ 85°C | RF Family/Standard: 802.15.4, Bluetooth, WiFi Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee® Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.05V, 1.8V, 2.2V Operating Temperature: -30°C ~ 85°C Mounting Type: Surface Mount Package / Case: 74-WFBGA, WLBGA Supplier Device Package: 74-eWLP (3.46×4.68) | 944 | |
| N/A | N/A | 88W8977-A1-NMVE/AK | NXP Semiconductors | IC | RF Transceiver ICs | 68-QFN (8x8) | 1.05V, 1.8V, 2.2V | -30°C ~ 85°C (TA) | RF Family/Standard: 802.15.4, Bluetooth, WiFi Protocol: 802.11a/b/g/n, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee® Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK Frequency: 2.4GHz ~ 2.5GHz, 4.9GHz ~ 5.925GHz Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.05V, 1.8V, 2.2V Current – Receiving: 35mA ~ 60mA Current – Transmitting: 90mA ~ 148mA Operating Temperature: -30°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-QFN (8×8) | 1,207 | |
| N/A | | 88W8977-A1-NMVE/AZ | NXP Semiconductors | 1X1 11N DUAL BAND + BT IN T&R (E | RF Transceiver ICs | 68-HVQFN (8x8) | 1.05V, 1.8V, 2.2V | -30°C ~ 85°C | RF Family/Standard: 802.15.4, Bluetooth, WiFi Protocol: 802.11a/b/g, Bluetooth v5.2, Class 2, GPS, GSM, LTE, WCDMA, Zigbee® Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.05V, 1.8V, 2.2V Operating Temperature: -30°C ~ 85°C Mounting Type: Surface Mount Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 526 | |
| N/A | | 88W8987-A1-NYEI/AZ | NXP Semiconductors | 1X1 11AC WAVE-2 CHIP WITH BT/LE; | RF Transceiver ICs | 68-HVQFN (8x8) | 1.1V, 1.8V, 2.2V | -40°C ~ 85°C | RF Family/Standard: Bluetooth, WiFi Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.1V, 1.8V, 2.2V Current – Receiving: 38mA ~ 82mA Current – Transmitting: 79mA ~ 145mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 1,285 | |
| N/A | | 88W8987-A2-EAHE/AZ | NXP Semiconductors | 1X1 11AC WAVE-2 CHIP WITH BT/LE | RF Transceiver ICs | 83-WLCSP (4.6x4.2) | 1.1V, 1.8V, 2.2V | -30°C ~ 85°C | RF Family/Standard: Bluetooth, WiFi Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.1V, 1.8V, 2.2V Current – Receiving: 38mA ~ 82mA Current – Transmitting: 79mA ~ 145mA Operating Temperature: -30°C ~ 85°C Mounting Type: Surface Mount Package / Case: 83-WFBGA, WLCSP Supplier Device Package: 83-WLCSP (4.6×4.2) | 225 | |
| N/A | | 88W8987-A2-NYEA/AK | NXP Semiconductors | 1X1 11AC WAVE-2 CHIP WITH BT/LE; | RF Transceiver ICs | 68-HVQFN (8x8) | 1.1V, 1.8V, 2.2V | -40°C ~ 85°C | RF Family/Standard: Bluetooth, WiFi Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.1V, 1.8V, 2.2V Current – Receiving: 38mA ~ 82mA Current – Transmitting: 79mA ~ 145mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 1,666 | |
| N/A | N/A | 88W8987-A2-NYEA/AZ | NXP Semiconductors | IC | RF Transceiver ICs | 68-HVQFN (8x8) | 1.1V, 1.8V, 2.2V | – | RF Family/Standard: Bluetooth, WiFi Voltage – Supply: 1.1V, 1.8V, 2.2V Mounting Type: Surface Mount Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 891 | |
| N/A | | 88W8987-A2-NYEA/BZ | NXP Semiconductors | 1X1 11AC WAVE-2 CHIP WITH BT/LE; | RF Transceiver ICs | N/A | N/A | N/A | N/A | 417 | |
| N/A | | 88W8987-A2-NYEE/AK | NXP Semiconductors | 1X1 11AC WAVE-2 CHIP WITH BT/LE; | RF Transceiver ICs | 68-HVQFN (8x8) | 1.1V, 1.8V, 2.2V | -30°C ~ 85°C | RF Family/Standard: Bluetooth, WiFi Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.1V, 1.8V, 2.2V Current – Receiving: 38mA ~ 82mA Current – Transmitting: 79mA ~ 145mA Operating Temperature: -30°C ~ 85°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 585 | |
| N/A | | 88W8987-A2-NYEE/AZ | NXP Semiconductors | 1X1 11AC WAVE-2 CHIP WITH BT/LE; | RF Transceiver ICs | 68-HVQFN (8x8) | 1.1V, 1.8V, 2.2V | -30°C ~ 85°C | RF Family/Standard: Bluetooth, WiFi Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.1V, 1.8V, 2.2V Current – Receiving: 38mA ~ 82mA Current – Transmitting: 79mA ~ 145mA Operating Temperature: -30°C ~ 85°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 716 | |
| N/A | | 88W8987-A2-NYEI/AK | NXP Semiconductors | 1X1 11AC WAVE-2 CHIP WITH BT/LE; | RF Transceiver ICs | 68-HVQFN (8x8) | 1.1V, 1.8V, 2.2V | -40°C ~ 85°C | RF Family/Standard: Bluetooth, WiFi Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.1V, 1.8V, 2.2V Current – Receiving: 38mA ~ 82mA Current – Transmitting: 79mA ~ 145mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 674 | |
| N/A | | 88W8987-A2-NYEI/AZ | NXP Semiconductors | 1X1 11AC WAVE-2 CHIP WITH BT/LE; | RF Transceiver ICs | 68-HVQFN (8x8) | 1.1V, 1.8V, 2.2V | -40°C ~ 85°C | RF Family/Standard: Bluetooth, WiFi Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.1V, 1.8V, 2.2V Current – Receiving: 38mA ~ 82mA Current – Transmitting: 79mA ~ 145mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 1,089 | |
| N/A | | 88W8987SA2-NYEA/BK | NXP Semiconductors | 1X1 11AC WAVE-2 OR 11P CHIP WITH | RF Transceiver ICs | 68-HVQFN (8x8) | 1.1V, 1.8V, 2.2V | -40°C ~ 85°C | RF Family/Standard: Bluetooth, WiFi Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART Voltage – Supply: 1.1V, 1.8V, 2.2V Current – Receiving: 38mA ~ 82mA Current – Transmitting: 79mA ~ 145mA Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 68-VFQFN Exposed Pad Supplier Device Package: 68-HVQFN (8×8) | 1,690 | |
 | | 88W8997-A1-CBQE/AZ | NXP Semiconductors | 2X2 WAVE2 WIFI + BT | RF Transceiver ICs | 161-WLCSP | - | – | RF Family/Standard: Bluetooth Protocol: 802.11ac, Bluetooth v5.1 Serial Interfaces: PCM, SDIO, UART, USB Mounting Type: Surface Mount Package / Case: 161-BGA, WLCSP Supplier Device Package: 161-WLCSP | 104 | |
| N/A | | 88W8997-A1-NXWE/AK | NXP Semiconductors | 2X2 802.11AC WAVE2 DUAL BAND WI- | RF Transceiver ICs | 98-HVQFN (9x9) | - | – | RF Family/Standard: Bluetooth Protocol: 802.11ac, Bluetooth v5.1 Serial Interfaces: PCM, SDIO, UART, USB Mounting Type: Surface Mount Package / Case: 98-VFQFN Exposed Pad Supplier Device Package: 98-HVQFN (9×9) | 629 | |
| N/A | | 88W8997-A1-NXWE/AZ | NXP Semiconductors | 2X2 802.11AC WAVE2 DUAL BAND WI- | RF Transceiver ICs | 98-HVQFN (9x9) | - | – | RF Family/Standard: Bluetooth Protocol: 802.11ac, Bluetooth v5.1 Serial Interfaces: PCM, SDIO, UART, USB Mounting Type: Surface Mount Package / Case: 98-VFQFN Exposed Pad Supplier Device Package: 98-HVQFN (9×9) | 254 | |