 | | AM2432BSDGHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 1,323 | |
 | | AM2432BSDGHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,958 | |
 | | AM2432BSEFHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 387 | |
 | | AM2432BSEFHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,329 | |
 | | AM2432BSFFHIALV | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 135 | |
 | | AM2432BSFFHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Quad-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 145 | |
 | | AM2432BSFFHIALXR | Texas Instruments | IC MCU 32BIT 256KB TCM 293VFBGA | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 7 | |
 | | AM2434BSDFHIALVR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 186 | |
 | | AM2434BSDFHIALXR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 665 | |
 | | AM2434BSDGHIALVR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 1,053 | |
 | | AM2434BSDGHIALXR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,870 | |
 | | AM2434BSEFHIALVR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 530 | |
 | | AM2434BSEFHIALXR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 1,122 | |
 | | AM2434BSFFHIALV | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 526 | |
 | | AM2434BSFFHIALVR | Texas Instruments | IC MCU 32BIT 256KB TCM 441FCBGA | Microcontrollers | 441-FCBGA (17.2x17.2) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 441-FCBGA (17.2×17.2) Package / Case: 441-BFBGA, FCBGA | 1,897 | |
 | | AM2434BSFFHIALXR | Texas Instruments | QUAD-CORE ARM CORTEX-R5F-BASED M | Microcontrollers | 293-FC/CSP (11x11) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F, ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART, USB Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.71V ~ 1.89V, 3.135V ~ 3.465V Data Converters: A/D 8x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 293-FC/CSP (11×11) Package / Case: 293-VFBGA, FCCSPBGA | 825 | |
 | | AM2614FM | Advanced Micro Devices | IC DRIVER 4/0 16CFLATPACK | Drivers, Receivers, Transceivers | 16-CFlatPack | 4.5V ~ 5.5V | -55°C ~ 125°C (TA) | Number of Drivers/Receivers: 4/0 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -55°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-CFlatPack Supplier Device Package: 16-CFlatPack | 170 | |
 | | AM2631CNDGHAZCZR | Texas Instruments | IC MCU 64BIT 256KB TCM 324NFBGA | Microcontrollers | 324-NFBGA (15x15) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 6x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 324-NFBGA (15×15) | 1,078 | |
 | | AM2631CNDGHMZCZRQ1 | Texas Instruments | IC MCU 32BIT 256KB TCM 324LFBGA | Microcontrollers | 324-NFBGA (15x15) | N/A | -40°C ~ 150°C (TJ) | Core Processor: ARM® Cortex®-R5F Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 6x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 324-NFBGA (15×15) | 612 | |
 | | AM2631CODGHMZCZRQ1 | Texas Instruments | IC MCU 64BIT 256KB TCM 324NFBGA | Microcontrollers | 324-NFBGA (15x15) | N/A | -40°C ~ 150°C (TJ) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART Peripherals: AES, DMA, POR, PWM, SHA, TRNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: Tightly Coupled Memory (TCM) Voltage – Supply (Vcc/Vdd): 1.14V ~ 1.26V Data Converters: A/D 6x12b SAR; D/A 1x12b Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 324-NFBGA (15×15) | 464 | |