Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
C8051T323-GMR
C8051T323-GMRSilicon LabsIC MCU 8BIT 16KB OTP 28QFNMicrocontrollers28-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
48 MIPS
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (5×5)
Package / Case:
28-VFQFN Exposed Pad
933
C8051T326-GM
C8051T326-GMSilicon LabsIC MCU 8BIT 16KB OTP 28QFNMicrocontrollers28-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
48 MIPS
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (5×5)
Package / Case:
28-VFQFN Exposed Pad
1,047
C8051T326-GMR
C8051T326-GMRSilicon LabsIC MCU 8BIT 16KB OTP 28QFNMicrocontrollers28-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
48 MIPS
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (5×5)
Package / Case:
28-VFQFN Exposed Pad
1,574
C8051T327-GM
C8051T327-GMSilicon LabsIC MCU 8BIT 16KB OTP 28QFNMicrocontrollers28-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
48 MIPS
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (5×5)
Package / Case:
28-VFQFN Exposed Pad
1,401
C8051T327-GMR
C8051T327-GMRSilicon LabsIC MCU 8BIT 16KB OTP 28QFNMicrocontrollers28-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
48 MIPS
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
1.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-QFN (5×5)
Package / Case:
28-VFQFN Exposed Pad
477
C8051T600-GM
C8051T600-GMSilicon LabsIC MCU 8BIT 8KB OTP 11QFNMicrocontrollers11-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
8
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
11-QFN (3×3)
Package / Case:
10-VFDFN Exposed Pad
727
C8051T600-GMR
C8051T600-GMRSilicon LabsIC MCU 8BIT 8KB OTP 11QFNMicrocontrollers11-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
8
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
11-QFN (3×3)
Package / Case:
10-VFDFN Exposed Pad
818
C8051T600-GS
C8051T600-GSSilicon LabsIC MCU 8BIT 8KB OTP 14SOICMicrocontrollers14-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
8
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-SOIC
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
930
C8051T600-GSR
C8051T600-GSRSilicon LabsIC MCU 8BIT 8KB OTP 14SOICMicrocontrollers14-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
8
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-SOIC
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
125
C8051T601-GM
C8051T601-GMSilicon LabsIC MCU 8BIT 8KB OTP 11QFNMicrocontrollers11-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
11-QFN (3×3)
Package / Case:
10-VFDFN Exposed Pad
684
C8051T601-GMR
C8051T601-GMRSilicon LabsIC MCU 8BIT 8KB OTP 11QFNMicrocontrollers11-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
11-QFN (3×3)
Package / Case:
10-VFDFN Exposed Pad
498
C8051T601-GS
C8051T601-GSSilicon LabsIC MCU 8BIT 8KB OTP 14SOICMicrocontrollers14-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-SOIC
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
160
C8051T601-GSR
C8051T601-GSRSilicon LabsIC MCU 8BIT 8KB OTP 14SOICMicrocontrollers14-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-SOIC
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
229
C8051T602-GM
C8051T602-GMSilicon LabsIC MCU 8BIT 4KB OTP 11QFNMicrocontrollers11-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
8
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
11-QFN (3×3)
Package / Case:
10-VFDFN Exposed Pad
1,409
C8051T602-GMR
C8051T602-GMRSilicon LabsIC MCU 8BIT 4KB OTP 11QFNMicrocontrollers11-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
8
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
11-QFN (3×3)
Package / Case:
10-VFDFN Exposed Pad
725
C8051T602-GS
C8051T602-GSSilicon LabsIC MCU 8BIT 4KB OTP 14SOICMicrocontrollers14-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
8
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-SOIC
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
628
C8051T602-GSR
C8051T602-GSRSilicon LabsIC MCU 8BIT 4KB OTP 14SOICMicrocontrollers14-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
8
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-SOIC
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
339
C8051T603-GM
C8051T603-GMSilicon LabsIC MCU 8BIT 4KB OTP 11QFNMicrocontrollers11-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
11-QFN (3×3)
Package / Case:
10-VFDFN Exposed Pad
1,855
C8051T603-GMR
C8051T603-GMRSilicon LabsIC MCU 8BIT 4KB OTP 11QFNMicrocontrollers11-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
11-QFN (3×3)
Package / Case:
10-VFDFN Exposed Pad
962
C8051T603-GS
C8051T603-GSSilicon LabsIC MCU 8BIT 4KB OTP 14SOICMicrocontrollers14-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
8
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-SOIC
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
454

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