Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
C8051T627-B-GMR
C8051T627-B-GMRSilicon LabsIC MCU 8BIT 32KB OTP 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
48 MIPS
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
3.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.25V
Data Converters:
A/D 21x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
613
N/A
C8051T630-GDISilicon LabsIC MCU 8BIT 8KB OTP DIEMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
Die
920
C8051T630-GMN/AC8051T630-GMSilicon LabsIC MCU 8BIT 8KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
774
C8051T630-GMRN/AC8051T630-GMRSilicon LabsIC MCU 8BIT 8KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
1,499
C8051T631-GMN/AC8051T631-GMSilicon LabsIC MCU 8BIT 8KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
500
C8051T631-GMRN/AC8051T631-GMRSilicon LabsIC MCU 8BIT 8KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
1,015
C8051T632-GMN/AC8051T632-GMSilicon LabsIC MCU 8BIT 4KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
158
C8051T632-GMRN/AC8051T632-GMRSilicon LabsIC MCU 8BIT 4KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
406
C8051T633-GMN/AC8051T633-GMSilicon LabsIC MCU 8BIT 4KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
39
C8051T633-GMRN/AC8051T633-GMRSilicon LabsIC MCU 8BIT 4KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
988
C8051T634-GMN/AC8051T634-GMSilicon LabsIC MCU 8BIT 2KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
261
C8051T634-GMRN/AC8051T634-GMRSilicon LabsIC MCU 8BIT 2KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
17
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
723
C8051T635-GM
C8051T635-GMSilicon LabsIC MCU 8BIT 2KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
168
C8051T635-GMR
C8051T635-GMRSilicon LabsIC MCU 8BIT 2KB OTP 20QFNMicrocontrollers20-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
SMBus (2-Wire/I2C), SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
OTP
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (4×4)
Package / Case:
20-VFQFN Exposed Pad
1,161
C87F7932BU-T7-H
C87F7932BU-T7-Honsemi8-BIT, FLASH PQFP64MicrocontrollersN/AN/AN/A

N/A

1,410
N/A
C88F83B0AU-TC-HonsemiIC MCU 16BIT 128KB FLASH 120TQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
Xstormy16
Core Size:
16-Bit
Speed:
4.2MHz
Connectivity:
SIO, UART/USART
Peripherals:
LCD, WDT
Number of I/O:
20
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.3V ~ 5.5V
Data Converters:
A/D 4x12b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
120-TQFP
872
N/A
C88F85D0AU-TC-HonsemiIC MCU 16BIT 256KB FLASH 120TQFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
Xstormy16
Core Size:
16-Bit
Speed:
10MHz
Connectivity:
I2C, SIO, UART/USART
Peripherals:
LCD, WDT
Number of I/O:
20
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
120-TQFP
947
N/AN/AC9KEAZ128AMLHNXP SemiconductorsICMicrocontrollersN/AN/AN/A

N/A

562
N/AN/AC9KEAZ128AVLHNXP SemiconductorsICMicrocontrollersN/AN/AN/A

N/A

300
N/AN/AC9KEAZ64AMLHNXP SemiconductorsICMicrocontrollersN/AN/AN/A

N/A

886

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