 | | CY9BF167NPMC-GNE2 | Infineon Technologies | IC MCU 32BIT 800KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 800KB (800K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 196 | |
 | | CY9BF167NPQC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 800KB FLASH 100PQFP | Microcontrollers | 100-PQFP (14x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 800KB (800K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-PQFP (14×20) | 371 | |
 | | CY9BF167RBGL-GK7E1 | Infineon Technologies | IC MCU 32BIT 800KB FLASH 144FBGA | Microcontrollers | 144-FBGA (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 800KB (800K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-FBGA (7×7) | 1,249 | |
 | | CY9BF167RPMC-G-MNE2 | Infineon Technologies | IC MCU 32BIT 800KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 800KB (800K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 1,806 | |
 | | CY9BF167RPMC-GNE2 | Infineon Technologies | IC MCU 32BIT 800KB FLASH 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 800KB (800K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 1,155 | |
 | | CY9BF168MPMC-G-MNE2 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 80LQFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 801 | |
 | | CY9BF168MPMC-GNE2 | Infineon Technologies | IC MCU 32BT 1.03125MB FLSH 80QFP | Microcontrollers | 80-LQFP (12x12) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (12×12) | 1,974 | |
 | | CY9BF168MPMC1-G-JNE2 | Infineon Technologies | IC MCU 32B 1.03125MB FLSH 80LQFP | Microcontrollers | 80-LQFP (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-LQFP (14×14) | 79 | |
 | | CY9BF168NBGL-GE1 | Infineon Technologies | IC MCU 32BIT 1.03125MB 112FBGA | Microcontrollers | 112-FBGA (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-FBGA (7×7) | 1,701 | |
 | | CY9BF168NPMC-G-MNE2 | Infineon Technologies | IC MCU 32BIT 1.03125MB 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,291 | |
 | | CY9BF168NPMC-GNE2 | Infineon Technologies | IC MCU 32B 1.03125MB FLSH 100QFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 10 | |
 | | CY9BF168NPQC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 1.03125MB 100PQFP | Microcontrollers | 100-PQFP (14x20) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-PQFP (14×20) | 934 | |
 | | CY9BF168RBGL-GK7E1 | Infineon Technologies | IC MCU 32BIT 1.03125MB 144FBGA | Microcontrollers | 144-FBGA (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-FBGA (7×7) | 256 | |
 | | CY9BF168RPMC-G-MNE2 | Infineon Technologies | IC MCU 32BIT 1.03125MB 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 899 | |
 | | CY9BF168RPMC-G-MNERE2 | Infineon Technologies | MULTI-MARKET MCUS | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 890 | |
 | | CY9BF168RPMC-GNE2 | Infineon Technologies | IC MCU 32B 1.03125MB FLSH 120QFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 658 | |
 | | CY9BF168RPMC-GNERE2 | Infineon Technologies | IC MCU 32B 1.03125MB FLSH 120QFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A 2x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 1,283 | |
 | | CY9BF216TBGL-GK7E1 | Infineon Technologies | IC MCU 32BIT 512KB FLASH 192FBGA | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 737 | |
 | | CY9BF217TBGL-GK7E1 | Infineon Technologies | IC MCU 32BIT 768KB FLASH 192FBGA | Microcontrollers | 192-FBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 192-FBGA (12×12) | 896 | |
 | | CY9BF218SPMC-GK7CGE1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,915 | |