Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,054
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DF2238BFA13IVDF2238BFA13IVRenesasIC MCU 16BIT 256KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
740
DF2238BFA13VDF2238BFA13VRenesasIC MCU 16BIT 256KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
1,331
DF2238BTE13N/ADF2238BTE13RenesasIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
454
DF2238BTE13VDF2238BTE13VRenesasIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
830
DF2238BTF13VDF2238BTF13VRenesasIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,448
DF2238RBR13N/ADF2238RBR13RenesasIC MCU 16BIT 256KB FLSH 112LFBGAMicrocontrollers112-LFBGA (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
1,437
DF2238RBR13VDF2238RBR13VRenesasIC MCU 16BIT 256KB FLSH 112LFBGAMicrocontrollers112-LFBGA (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
1,028
DF2238RBR13WVDF2238RBR13WVRenesasIC MCU 16BIT 256KB FLSH 112LFBGAMicrocontrollers112-LFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LFBGA (10×10)
Package / Case:
112-LFBGA
420
DF2238RFA13VDF2238RFA13VRenesasIC MCU 16BIT 256KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
223
DF2238RTE13VDF2238RTE13VRenesasIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
485
DF2238RTE6VDF2238RTE6VRenesasIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
6MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
752
DF2238RTF13N/ADF2238RTF13RenesasIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,578
DF2238RTF13VDF2238RTF13VRenesasIC MCU 16BIT 256KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
13MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
520
DF2239FA16VDF2239FA16VRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
867
DF2239FA20IVDF2239FA20IVRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
874
DF2239FA20VDF2239FA20VRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
1,182
DF2239TE16VDF2239TE16VRenesasIC MCU 16BIT 384KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
138
DF2239TE20VDF2239TE20VRenesasIC MCU 16BIT 384KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
679
DF2239TF16VDF2239TF16VRenesasIC MCU 16BIT 384KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
375
DF2239TF20IDF2239TF20IRenesasIC MCU 16BIT 384KB FLASH 100TQFPMicrocontrollers100-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
72
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (12×12)
Package / Case:
100-TQFP
1,226

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