Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DF36074GFZVDF36074GFZVRenesasIC MCU 16BIT 32KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
752
DF36074GFZWVDF36074GFZWVRenesasIC MCU 16BIT 32KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
8
DF36074GHVDF36074GHVRenesasIC MCU 16BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
620
DF36074GHWVDF36074GHWVRenesasIC MCU 16BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,025
DF36074LFZVDF36074LFZVRenesasIC MCU 16BIT 32KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
554
DF36074LFZWVDF36074LFZWVRenesasIC MCU 16BIT 32KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
261
DF36074LHVDF36074LHVRenesasIC MCU 16BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
71
DF36074LHWVDF36074LHWVRenesasIC MCU 16BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
853
DF36077GFZVDF36077GFZVRenesasIC MCU 16BIT 56KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,576
DF36077GHVDF36077GHVRenesasIC MCU 16BIT 56KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
394
DF36077GHWVDF36077GHWVRenesasIC MCU 16BIT 56KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
330
DF36077LHVDF36077LHVRenesasIC MCU 16BIT 56KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,990
DF36078GFZVDF36078GFZVRenesasIC MCU 16BIT 96KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
631
DF36079GFZVDF36079GFZVRenesasIC MCU 16BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,977
DF36079GFZV#YRN/ADF36079GFZV#YRRenesasIC MCU 16BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
682
DF36079GHVDF36079GHVRenesasIC MCU 16BIT 128KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,322
DF36079LFZVDF36079LFZVRenesasIC MCU 16BIT 128KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
877
DF36079LHVDF36079LHVRenesasIC MCU 16BIT 128KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
47
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
364
DF36087FPVDF36087FPVRenesasIC MCU 16BIT 56KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
18MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
45
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,363
DF36087HVDF36087HVRenesasIC MCU 16BIT 56KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
18MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
45
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,607

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