Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DG529EWNDG529EWNAnalog Devices Inc.IC SWITCH SP4T X 2 450OHM 18SOICAnalog Switches, Multiplexers, Demultiplexers18-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
450Ohm
Voltage – Supply, Single (V+):
5V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
1.5µs, 1.5µs
Charge Injection:
4pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
5nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
18-SOIC
1,454
DG529EWN+DG529EWN+Analog Devices Inc.IC SWITCH SP4T X 2 450OHM 18SOICAnalog Switches, Multiplexers, Demultiplexers18-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
450Ohm
Voltage – Supply, Single (V+):
5V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
1.5µs, 1.5µs
Charge Injection:
4pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
5nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
18-SOIC
1,000
DG529EWN+TDG529EWN+TAnalog Devices Inc.IC SWITCH SP4T X 2 450OHM 18SOICAnalog Switches, Multiplexers, Demultiplexers18-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
450Ohm
Voltage – Supply, Single (V+):
5V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
1.5µs, 1.5µs
Charge Injection:
4pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
5nA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
18-SOIC
279
DHDLF2406APZADHDLF2406APZATexas InstrumentsIC MCU 16BIT 64KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
C2xx DSP
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
CANbus, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
41
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
5K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,163
DIR1701EDIR1701ETexas InstrumentsIC RECEIVER 28SSOPDrivers, Receivers, Transceivers28-SSOP3V ~ 3.6V-25°C ~ 85°C
Type:
Receiver
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-25°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
Supplier Device Package:
28-SSOP
57
DIR1703EDIR1703ETexas InstrumentsIC RECEIVER 28SSOPDrivers, Receivers, Transceivers28-SSOP3V ~ 3.6V-25°C ~ 85°C
Type:
Receiver
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-25°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
Supplier Device Package:
28-SSOP
899
N/AN/ADIR1703E/2KTexas InstrumentsIC RECEIVER 0/1 28SSOPDrivers, Receivers, Transceivers28-SSOP3V ~ 3.6V-25°C ~ 85°C
Type:
Receiver
Number of Drivers/Receivers:
0/1
Voltage – Supply:
3V ~ 3.6V
Operating Temperature:
-25°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
Supplier Device Package:
28-SSOP
235
N/ADM860-TEMicrochip TechnologyIC MPU 240MHZ 292LFBGAMicroprocessors292-LFBGA (17x17)N/A–
Core Processor:
ARM926EJ
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
240MHz
Co-Processors/DSP:
Multimedia: Audio Engine, Security; Real Time Secure
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps
USB:
USB 2.0 OTG (1)
Mounting Type:
Surface Mount
Package / Case:
292-LFBGA
Supplier Device Package:
292-LFBGA (17×17)
Multimedia:
Audio Engine
933
N/AN/ADM860A-AQEMicrochip TechnologyIC MPU 240MHZ 320LFBGAMicroprocessors320-LFBGA (13x13)N/A–
Core Processor:
ARM926EJ
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
240MHz
Co-Processors/DSP:
Multimedia: Audio Engine, Security; Real Time Secure
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps
USB:
USB 2.0 OTG (1)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-LFBGA (13×13)
Multimedia:
Audio Engine
411
N/AN/ADM860A-LTBMicrochip TechnologyIC MPU 240MHZ 320LFBGAMicroprocessors320-LFBGA (13x13)N/A–
Core Processor:
ARM926EJ
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
240MHz
Co-Processors/DSP:
Multimedia: Audio Engine, Security; Real Time Secure
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps
USB:
USB 2.0 OTG (1)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-LFBGA (13×13)
Multimedia:
Audio Engine
873
N/ADM870-TEMicrochip TechnologyIC MPU 240MHZ 292LFBGAMicroprocessors292-LFBGA (17x17)N/A–
Core Processor:
ARM926EJ
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
240MHz
Co-Processors/DSP:
Multimedia: Audio Engine, Security; Real Time Secure
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps
USB:
USB 2.0 OTG (1)
Mounting Type:
Surface Mount
Package / Case:
292-LFBGA
Supplier Device Package:
292-LFBGA (17×17)
Multimedia:
Audio Engine
1,096
N/AN/ADM870A-AQEMicrochip TechnologyIC MPU 240MHZ 320LFBGAMicroprocessors320-LFBGA (13x13)N/A–
Core Processor:
ARM926EJ
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
240MHz
Co-Processors/DSP:
Multimedia: Audio Engine, Security; Real Time Secure
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps
USB:
USB 2.0 OTG (1)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-LFBGA (13×13)
Multimedia:
Audio Engine
96
N/AN/ADM870A-LTBMicrochip TechnologyIC MPU 240MHZ 320LFBGAMicroprocessors320-LFBGA (13x13)N/A–
Core Processor:
ARM926EJ
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
240MHz
Co-Processors/DSP:
Multimedia: Audio Engine, Security; Real Time Secure
RAM Controllers:
SDRAM, SRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps
USB:
USB 2.0 OTG (1)
Mounting Type:
Surface Mount
Package / Case:
320-LFBGA
Supplier Device Package:
320-LFBGA (13×13)
Multimedia:
Audio Engine
1,973
DMF2802PZA-60DMF2802PZA-60Texas InstrumentsIC MCU 32BIT 64KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
C28x
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
CANbus, I2C, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
35
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
1.71V ~ 1.89V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,178
N/ADMNIAD01SLVBTIntelINTEL QUARK MICROCONTROLLER D100MicrocontrollersN/AN/AN/A

N/A

510
DN3687GFPVDN3687GFPVRenesasIC MCU 16BIT 56KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
299
DN3694GFPVDN3694GFPVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
944
DP83223VDP83223VTexas InstrumentsIC TRANSCEIVER 28PLCCDrivers, Receivers, Transceivers28-PLCC (11.51x11.51)4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
28-LCC (J-Lead)
Supplier Device Package:
28-PLCC (11.51×11.51)
1,376
DP83223VXDP83223VXTexas InstrumentsIC TRANSCEIVER 28PLCCDrivers, Receivers, Transceivers28-PLCC (11.51x11.51)4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
28-LCC (J-Lead)
Supplier Device Package:
28-PLCC (11.51×11.51)
1,748
DP8344BVN/ADP8344BVTexas InstrumentsIC MPU 20MHZ 84PLCCMicroprocessors84-PLCC (29.31x29.31)N/A0°C ~ 70°C (TA)
Number of Cores/Bus Width:
1 Core, 8-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
84-LCC (J-Lead)
Supplier Device Package:
84-PLCC (29.31×29.31)
Grade:
Commercial
68

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up