Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DS61650CW50FPVDS61650CW50FPVRenesasIC MCU 32BIT ROMLESS 120LQFPMicrocontrollers120-LQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
82
Program Memory Type:
ROMless
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-LQFP (14×14)
Package / Case:
120-LQFP
1,097
DS61651CN50FPVDS61651CN50FPVRenesasIC MCU 32BIT ROMLESS 120LQFPMicrocontrollers120-LQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
82
Program Memory Type:
ROMless
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-LQFP (14×14)
Package / Case:
120-LQFP
1,535
DS61651N50FPVDS61651N50FPVRenesasIC MCU 32BIT ROMLESS 120LQFPMicrocontrollers120-LQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8SX
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
82
Program Memory Type:
ROMless
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
120-LQFP (14×14)
Package / Case:
120-LQFP
629
DS70830AN80FTVDS70830AN80FTVRenesasIC MCU 32BIT ROMLESS 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
473
DS70850AD80FPVDS70850AD80FPVRenesasIC MCU 32BIT ROMLESS 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI, SSU
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
100
Program Memory Type:
ROMless
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
452
DS72011RB120FPVDS72011RB120FPVRenesasIC MCU 32BIT ROMLESS 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-20°C ~ 70°C (TA)
Core Processor:
SH-2A
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, FIFO, I2C, SCI, Serial Sound
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
670
DS72011RW100FPVDS72011RW100FPVRenesasIC MCU 32BIT ROMLESS 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2A
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, FIFO, I2C, SCI, Serial Sound
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
383
DS72060W200FPVDS72060W200FPVRenesasIC MCU 32BIT ROMLESS 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-20°C ~ 85°C (TA)
Core Processor:
SH-2A
Core Size:
32-Bit Single-Core
Speed:
200MHz
Connectivity:
EBI/EMI, FIFO, I2C, SCI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
71
Program Memory Type:
ROMless
RAM Size:
128K x 8
Voltage – Supply (Vcc/Vdd):
1.15V ~ 1.35V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
821
DS72611RP100FPVDS72611RP100FPVRenesasIC MCU 32BIT ROMLESS 176LFQFPMicrocontrollers176-LFQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
SH-2A
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, EBI/EMI, FIFO, I2C, SCI, Serial Sound
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
104
Program Memory Type:
ROMless
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LFQFP (24×24)
Package / Case:
176-LQFP
954
DS75176BMDS75176BMTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
325
DS75176BM/NOPBDS75176BM/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
714
DS75176BMXDS75176BMXTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,554
DS75176BMX/NOPBDS75176BMX/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
166
DS75176BNDS75176BNTexas InstrumentsIC TRANSCEIVER HALF 1/1 8DIPDrivers, Receivers, Transceivers8-PDIP4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-PDIP
499
DS75176BN/NOPBDS75176BN/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8MDIPDrivers, Receivers, Transceivers8-MDIP4.75V ~ 5.25V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-MDIP
778
DS75176BTMDS75176BTMTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
548
DS75176BTM/NOPBDS75176BTM/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
169
DS75176BTMXDS75176BTMXTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
147
DS75176BTMX/NOPBDS75176BTMX/NOPBTexas InstrumentsIC TRANSCEIVER HALF 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
54
DS75176BTNDS75176BTNTexas InstrumentsIC TRANSCEIVER HALF 1/1 8DIPDrivers, Receivers, Transceivers8-PDIP4.75V ~ 5.25V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS422, RS485
Number of Drivers/Receivers:
1/1
Duplex:
Half
Receiver Hysteresis:
70 mV
Voltage – Supply:
4.75V ~ 5.25V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-PDIP
699

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