Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
DSPIC33FJ06GS001-I/P
DSPIC33FJ06GS001-I/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
324
DSPIC33FJ06GS001-I/SO
DSPIC33FJ06GS001-I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
436
DSPIC33FJ06GS001-I/SS
DSPIC33FJ06GS001-I/SSMicrochip TechnologyIC MCU 16BIT 6KB FLASH 20SSOPMicrocontrollers20-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP
Package / Case:
20-SSOP (0.209″”, 5.30mm Width)
464
DSPIC33FJ06GS001T-I/SO
DSPIC33FJ06GS001T-I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
1,164
DSPIC33FJ06GS001T-I/SS
DSPIC33FJ06GS001T-I/SSMicrochip TechnologyIC MCU 16BIT 6KB FLASH 20SSOPMicrocontrollers20-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP
Package / Case:
20-SSOP (0.209″”, 5.30mm Width)
9
DSPIC33FJ06GS101-E/P
DSPIC33FJ06GS101-E/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
1,348
DSPIC33FJ06GS101-E/SO
DSPIC33FJ06GS101-E/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
259
DSPIC33FJ06GS101-I/P
DSPIC33FJ06GS101-I/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
342
DSPIC33FJ06GS101-I/SO
DSPIC33FJ06GS101-I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
838
DSPIC33FJ06GS101A-E/P
DSPIC33FJ06GS101A-E/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
583
DSPIC33FJ06GS101A-E/SO
DSPIC33FJ06GS101A-E/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
32
DSPIC33FJ06GS101A-E/SS
DSPIC33FJ06GS101A-E/SSMicrochip TechnologyIC MCU 16BIT 6KB FLASH 20SSOPMicrocontrollers20-SSOPN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP
Package / Case:
20-SSOP (0.209″”, 5.30mm Width)
524
DSPIC33FJ06GS101A-I/P
DSPIC33FJ06GS101A-I/PMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18DIPMicrocontrollers18-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
18-PDIP
Package / Case:
18-DIP (0.300″”, 7.62mm)
554
DSPIC33FJ06GS101A-I/SO
DSPIC33FJ06GS101A-I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
331
DSPIC33FJ06GS101A-I/SS
DSPIC33FJ06GS101A-I/SSMicrochip TechnologyIC MCU 16BIT 6KB FLASH 20SSOPMicrocontrollers20-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP
Package / Case:
20-SSOP (0.209″”, 5.30mm Width)
1,759
DSPIC33FJ06GS101AT-E/SO
DSPIC33FJ06GS101AT-E/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
1,361
DSPIC33FJ06GS101AT-I/SO
DSPIC33FJ06GS101AT-I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
775
DSPIC33FJ06GS101AT-I/SS
DSPIC33FJ06GS101AT-I/SSMicrochip TechnologyIC MCU 16BIT 6KB FLASH 20SSOPMicrocontrollers20-SSOPN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SSOP
Package / Case:
20-SSOP (0.209″”, 5.30mm Width)
1,596
DSPIC33FJ06GS101T-E/SOD21
DSPIC33FJ06GS101T-E/SOD21Microchip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 125°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (2K x 24)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
1,001
DSPIC33FJ06GS101T-I/SO
DSPIC33FJ06GS101T-I/SOMicrochip TechnologyIC MCU 16BIT 6KB FLASH 18SOICMicrocontrollers18-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
dsPIC
Core Size:
16-Bit
Speed:
40 MIPs
Connectivity:
I2C, IrDA, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
6KB (6K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
18-SOIC
Package / Case:
18-SOIC (0.295″”, 7.50mm Width)
272

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