Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AEDFB232A1MA-GD-F-DMicron Technology Inc.IC DRAM 32GBIT PARALLEL 800MHZDRAM MemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
1,795
N/AN/AEDFB232A1MA-GD-F-R TRMicron Technology Inc.IC DRAM 32GBIT PARALLEL 800MHZDRAM MemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
800 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
1,066
N/AN/AEDFB232A1MA-JD-F-DMicron Technology Inc.IC DRAM 32GBIT PARALLEL 933MHZDRAM MemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
933 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
871
N/AN/AEDFB232A1MA-JD-F-R TRMicron Technology Inc.IC DRAM 32GBIT PARALLEL 933MHZDRAM MemoryN/A1.14V ~ 1.95V-30°C ~ 85°C (TA)
Access Time:
N/A
Clock Frequency:
933 MHz
Grade:
Commercial (Extended)
Memory Format:
DRAM
Memory Interface:
Parallel
Memory Organization:
1G x 32
Memory Size:
32 Gbit
Memory Type:
Volatile
Packaging:
N/A
Qualification:
N/A
Technology:
SDRAM - Mobile LPDDR3
Write Cycle Time Word Page:
N/A
439
EE80C186XL20EE80C186XL20IntelIC MPU I186 20MHZ 68PLCCMicroprocessors68-PLCCN/A0°C ~ 70°C (TA)
Core Processor:
80C186
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
20MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
68-LCC (J-Lead)
Supplier Device Package:
68-PLCC
Grade:
Commercial
306
EE80C51FA24N/AEE80C51FA24IntelMICROCONTROLLER, 8 BIT, MCS51 COMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
MCS 51
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
SIO
Peripherals:
PWM, WDT
Number of I/O:
32
Program Memory Type:
ROMless
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
586
EE87C51RC24N/AEE87C51RC24IntelIC MCU 8BIT 32KB OTP 44PLCCMicrocontrollers44-PLCCN/A-40°C ~ 85°C (TA)
Core Processor:
MCS 51
Core Size:
8-Bit
Speed:
24MHz
Connectivity:
SIO
Peripherals:
WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-PLCC
Package / Case:
44-LCC (J-Lead)
1,378
EFM32G200F16-QFN32EFM32G200F16-QFN32Silicon LabsIC MCU 32BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
673
EFM32G200F16-QFN32TEFM32G200F16-QFN32TSilicon LabsIC MCU 32BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
886
EFM32G200F16G-E-QFN32EFM32G200F16G-E-QFN32Silicon LabsIC MCU 32BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
776
EFM32G200F16G-E-QFN32REFM32G200F16G-E-QFN32RSilicon LabsIC MCU 32BIT 16KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
267
EFM32G200F32-QFN32EFM32G200F32-QFN32Silicon LabsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
505
EFM32G200F32-QFN32TEFM32G200F32-QFN32TSilicon LabsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
749
EFM32G200F32G-E-QFN32EFM32G200F32G-E-QFN32Silicon LabsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
1,832
EFM32G200F32G-E-QFN32REFM32G200F32G-E-QFN32RSilicon LabsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
385
EFM32G200F64-QFN32EFM32G200F64-QFN32Silicon LabsIC MCU 32BIT 64KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
1,323
EFM32G200F64-QFN32TEFM32G200F64-QFN32TSilicon LabsIC MCU 32BIT 64KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.85V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
23
EFM32G200F64G-E-QFN32EFM32G200F64G-E-QFN32Silicon LabsIC MCU 32BIT 64KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
1,085
EFM32G200F64G-E-QFN32REFM32G200F64G-E-QFN32RSilicon LabsIC MCU 32BIT 64KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
815
EFM32G210F128-QFN32EFM32G210F128-QFN32Silicon LabsIC MCU 32BIT 128KB FLASH 32QFNMicrocontrollers32-QFN (6x6)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
32MHz
Connectivity:
I2C, IrDA, SmartCard, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.98V ~ 3.8V
Data Converters:
A/D 4x12b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (6×6)
Package / Case:
32-VQFN Exposed Pad
814

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