Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EFM8SB10F4G-A-QFN20EFM8SB10F4G-A-QFN20Silicon LabsIC MCU 8BIT 4KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-UFQFN Exposed Pad
461
EFM8SB10F4G-A-QFN20REFM8SB10F4G-A-QFN20RSilicon LabsIC MCU 8BIT 4KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-UFQFN Exposed Pad
656
EFM8SB10F8A-A-QFN20EFM8SB10F8A-A-QFN20Silicon LabsIC MCU 8BIT 8KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-UFQFN Exposed Pad
1,412
EFM8SB10F8A-A-QFN20REFM8SB10F8A-A-QFN20RSilicon LabsIC MCU 8BIT 8KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-UFQFN Exposed Pad
595
EFM8SB10F8A-A-QFN24EFM8SB10F8A-A-QFN24Silicon LabsIC MCU 8BIT 8KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
639
EFM8SB10F8A-A-QFN24REFM8SB10F8A-A-QFN24RSilicon LabsIC MCU 8BIT 8KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 125°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
622
EFM8SB10F8G-A-CSP16EFM8SB10F8G-A-CSP16Silicon LabsIC MCU 8BIT 8KB FLASH 16CSPMicrocontrollers16-CSP (1.78x1.66)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-CSP (1.78×1.66)
Package / Case:
16-UFBGA, WLCSP
1,587
EFM8SB10F8G-A-CSP16REFM8SB10F8G-A-CSP16RSilicon LabsIC MCU 8BIT 8KB FLASH 16CSPMicrocontrollers16-CSP (1.78x1.66)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-CSP (1.78×1.66)
Package / Case:
16-UFBGA, WLCSP
1,721
EFM8SB10F8G-A-QFN20EFM8SB10F8G-A-QFN20Silicon LabsIC MCU 8BIT 8KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-UFQFN Exposed Pad
997
EFM8SB10F8G-A-QFN20REFM8SB10F8G-A-QFN20RSilicon LabsIC MCU 8BIT 8KB FLASH 20QFNMicrocontrollers20-QFN (3x3)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 9x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-QFN (3×3)
Package / Case:
20-UFQFN Exposed Pad
542
EFM8SB10F8G-A-QFN24EFM8SB10F8G-A-QFN24Silicon LabsIC MCU 8BIT 8KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
405
EFM8SB10F8G-A-QFN24REFM8SB10F8G-A-QFN24RSilicon LabsIC MCU 8BIT 8KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
85
EFM8SB10F8G-A-QSOP24EFM8SB10F8G-A-QSOP24Silicon LabsIC MCU 8BIT 8KB FLASH 24QSOPMicrocontrollers24-QSOPN/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QSOP
Package / Case:
24-SSOP (0.154″”, 3.90mm Width)
1,626
EFM8SB10F8G-A-QSOP24REFM8SB10F8G-A-QSOP24RSilicon LabsIC MCU 8BIT 8KB FLASH 24QSOPMicrocontrollers24-QSOPN/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QSOP
Package / Case:
24-SSOP (0.154″”, 3.90mm Width)
703
EFM8SB20F16G-A-QFN24EFM8SB20F16G-A-QFN24Silicon LabsIC MCU 8BIT 16KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
4.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
1,401
EFM8SB20F16G-A-QFN24REFM8SB20F16G-A-QFN24RSilicon LabsIC MCU 8BIT 16KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
4.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
303
EFM8SB20F16G-B-QFN24EFM8SB20F16G-B-QFN24Silicon LabsIC MCU 8BIT 16KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
4.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
1,025
EFM8SB20F16G-B-QFN24REFM8SB20F16G-B-QFN24RSilicon LabsIC MCU 8BIT 16KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
4.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
1,720
EFM8SB20F32G-A-QFN24EFM8SB20F32G-A-QFN24Silicon LabsIC MCU 8BIT 32KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
439
EFM8SB20F32G-A-QFN24REFM8SB20F32G-A-QFN24RSilicon LabsIC MCU 8BIT 32KB FLASH 24QFNMicrocontrollers24-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
CIP-51 8051
Core Size:
8-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, I2C, SMBus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4.25K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN (4×4)
Package / Case:
24-WFQFN Exposed Pad
181

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