Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,621
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
EP1K30TC144-2
EP1K30TC144-2IntelIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
216
Number of Logic Elements/Cells:
1728
Total RAM Bits:
24576
Number of I/O:
102
Number of Gates:
119000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
594
EP1K30TC144-2NEP1K30TC144-2NIntelIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)2.375 V - 2.625 V0°C – 70°C
Grade:
Commercial
Number of Gates:
119000
Number of I/O:
102
Number of LABs/CLBs:
216
Number of Logic Elements/Cells:
1728
Qualification:
N/A
Total RAM Bits:
24576
1,655
EP1K30TC144-3
EP1K30TC144-3IntelIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
216
Number of Logic Elements/Cells:
1728
Total RAM Bits:
24576
Number of I/O:
102
Number of Gates:
119000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
484
EP1K30TC144-3N
EP1K30TC144-3NIntelIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
216
Number of Logic Elements/Cells:
1728
Total RAM Bits:
24576
Number of I/O:
102
Number of Gates:
119000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
1,419
EP1K30TI144-2EP1K30TI144-2IntelIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)2.375 V - 2.625 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
119000
Number of I/O:
102
Number of LABs/CLBs:
216
Number of Logic Elements/Cells:
1728
Qualification:
N/A
Total RAM Bits:
24576
624
EP1K30TI144-2N
EP1K30TI144-2NIntelIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)2.375V ~ 2.625V-40°C ~ 85°C (TA)
Number of LABs/CLBs:
216
Number of Logic Elements/Cells:
1728
Total RAM Bits:
24576
Number of I/O:
102
Number of Gates:
119000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 85°C (TA)
Package / Case:
144-LQFP
Supplier Device Package:
144-TQFP (20×20)
823
N/AEP1K30TI144-2NGAIntelIC FPGA 102 I/O 144TQFPFPGAs144-TQFP (20x20)2.375 V - 2.625 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
119000
Number of I/O:
102
Number of LABs/CLBs:
216
Number of Logic Elements/Cells:
1728
Qualification:
N/A
Total RAM Bits:
24576
1,048
EP1K50FC256-1EP1K50FC256-1IntelIC FPGA 186 I/O 256FBGAFPGAs256-FBGA (17x17)2.375 V - 2.625 V0°C – 70°C
Grade:
Commercial
Number of Gates:
199000
Number of I/O:
186
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Qualification:
N/A
Total RAM Bits:
40960
242
EP1K50FC256-1N
EP1K50FC256-1NIntelIC FPGA 186 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Total RAM Bits:
40960
Number of I/O:
186
Number of Gates:
199000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
1,059
EP1K50FC256-2
EP1K50FC256-2IntelIC FPGA 186 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Total RAM Bits:
40960
Number of I/O:
186
Number of Gates:
199000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
1,756
EP1K50FC256-2N
EP1K50FC256-2NIntelIC FPGA 186 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Total RAM Bits:
40960
Number of I/O:
186
Number of Gates:
199000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
392
EP1K50FC256-3
EP1K50FC256-3IntelIC FPGA 186 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Total RAM Bits:
40960
Number of I/O:
186
Number of Gates:
199000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
398
EP1K50FC256-3N
EP1K50FC256-3NIntelIC FPGA 186 I/O 256FBGAFPGAs256-FBGA (17x17)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Total RAM Bits:
40960
Number of I/O:
186
Number of Gates:
199000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
256-BGA
Supplier Device Package:
256-FBGA (17×17)
1,117
EP1K50FC484-1EP1K50FC484-1IntelIC FPGA 249 I/O 484FBGAFPGAs484-FBGA (23x23)2.375 V - 2.625 V0°C – 70°C
Grade:
Commercial
Number of Gates:
199000
Number of I/O:
249
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Qualification:
N/A
Total RAM Bits:
40960
559
EP1K50FC484-1N
EP1K50FC484-1NIntelIC FPGA 249 I/O 484FBGAFPGAs484-FBGA (23x23)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Total RAM Bits:
40960
Number of I/O:
249
Number of Gates:
199000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
674
EP1K50FC484-2EP1K50FC484-2IntelIC FPGA 249 I/O 484FBGAFPGAs484-FBGA (23x23)2.375 V - 2.625 V0°C – 70°C
Grade:
Commercial
Number of Gates:
199000
Number of I/O:
249
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Qualification:
N/A
Total RAM Bits:
40960
610
EP1K50FC484-2N
EP1K50FC484-2NIntelIC FPGA 249 I/O 484FBGAFPGAs484-FBGA (23x23)2.375V ~ 2.625V0°C ~ 70°C (TA)
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Total RAM Bits:
40960
Number of I/O:
249
Number of Gates:
199000
Voltage – Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 70°C (TA)
Package / Case:
484-BBGA
Supplier Device Package:
484-FBGA (23×23)
324
EP1K50FC484-3EP1K50FC484-3IntelIC FPGA 249 I/O 484FBGAFPGAs484-FBGA (23x23)2.375 V - 2.625 V0°C – 70°C
Grade:
Commercial
Number of Gates:
199000
Number of I/O:
249
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Qualification:
N/A
Total RAM Bits:
40960
802
EP1K50FC484-3NEP1K50FC484-3NIntelIC FPGA 249 I/O 484FBGAFPGAs484-FBGA (23x23)2.375 V - 2.625 V0°C – 70°C
Grade:
Commercial
Number of Gates:
199000
Number of I/O:
249
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Qualification:
N/A
Total RAM Bits:
40960
190
EP1K50FI256-2EP1K50FI256-2IntelIC FPGA 186 I/O 256FBGAFPGAs256-FBGA (17x17)2.375 V - 2.625 V-40°C – 85°C
Grade:
Industrial
Number of Gates:
199000
Number of I/O:
186
Number of LABs/CLBs:
360
Number of Logic Elements/Cells:
2880
Qualification:
N/A
Total RAM Bits:
40960
788

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