| N/A | | FH8065301729602S R1W4 | Intel | IC MPU N2830 2.16GHZ 1170FCBGA | Microprocessors | 1170-FCBGA (25x27) | N/A | 100°C (TC) | Core Processor: Intel® Celeron® Processor N2830 Number of Cores/Bus Width: 2 Core, 64-Bit Graphics Acceleration: Yes USB: USB 2.0 (1), USB 3.0 (1) Voltage – I/O: 0.4V, 1.14V Operating Temperature: 100°C (TC) Security Features: AES, SecureKey Mounting Type: Surface Mount Package / Case: 1170-BGA, FCBGA Supplier Device Package: 1170-FCBGA (25×27) | 1,892 | |
 | N/A | FHND001CVAB | Flexxon | SLC NAND 1GB | Flash Memory | N/A | 2.7 ~ 3.6V | 0°C - 70°C | Memory Organization: 128M x 8 | 1,242 | |
 | N/A | FHND001CVBB | Flexxon | SLC NAND 1GB | Flash Memory | N/A | 2.7 ~ 3.6V | 0°C - 70°C | Memory Organization: 128M x 8 | 1,210 | |
 | N/A | FHND001CVCB | Flexxon | SLC NAND 1GB | Flash Memory | 63-VFBGA | 2.7 ~ 3.6V | 0°C - 70°C | Memory Organization: 128M x 8 Packaging: 9.0x11.0mm FBGA | 1,530 | |
 | N/A | FHND001CVTB | Flexxon | SLC NAND 1GB | Flash Memory | 48-TSOP I | 2.7 ~ 3.6V | 0°C - 70°C | Memory Organization: 128M x 8 | 738 | |
 | N/A | FHND001EVAB | Flexxon | SLC NAND 1GB | Flash Memory | N/A | 2.7 ~ 3.6V | -40°C - 85°C | Memory Organization: 128M x 8 | 259 | |
 | N/A | FHND001EVBB | Flexxon | SLC NAND 1GB | Flash Memory | N/A | 2.7 ~ 3.6V | -40°C - 85°C | Memory Organization: 128M x 8 | 1,369 | |
 | N/A | FHND001EVCB | Flexxon | SLC NAND 1GB | Flash Memory | 63-VFBGA | 2.7 ~ 3.6V | -40°C - 85°C | Memory Organization: 128M x 8 Packaging: 9.0x11.0mm FBGA | 1,576 | |
 | N/A | FHND001EVTB | Flexxon | SLC NAND 1GB | Flash Memory | 48-TSOP I | 2.7 ~ 3.6V | -40°C - 85°C | Memory Organization: 128M x 8 | 498 | |
 | N/A | FHND004CVC0 | Flexxon | SLC NAND 4GB | Flash Memory | 63-VFBGA | 2.7 ~ 3.6V | 0°C - 70°C | Memory Organization: 512M x 8 Packaging: 9.0x11.0mm FBGA | 357 | |
 | N/A | FHND004CVT0 | Flexxon | SLC NAND 4GB | Flash Memory | 48-TSOP I | 2.7 ~ 3.6V | 0°C - 70°C | Memory Organization: 512M x 8 | 757 | |
 | N/A | FHND004EVC0 | Flexxon | SLC NAND 4GB | Flash Memory | 63-VFBGA | 2.7 ~ 3.6V | -40°C – 85°C | Memory Organization: 512M x 8 Packaging: 9.0×11.0mm FBGA | 71 | |
 | N/A | FHND004EVT0 | Flexxon | SLC NAND 4GB | Flash Memory | 48-TSOP I | 2.7 ~ 3.6V | -40°C - 85°C | Memory Organization: 512M x 8 | 1,483 | |
 | | FIDO1100BGA208IR1 | Analog Devices Inc. | IC MCU 32BIT 32KB RREM 208BGA | Microcontrollers | 208-BGA (10x10) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, EIA-232, Ethernet, GPIO, HDLC, I2C, SMBus, SPI Peripherals: DMA, POR, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (10×10) | 1,338 | |
 | | FIDO1100BGB208IR1 | Analog Devices Inc. | IC MCU 32BIT 32KB RREM 208BGA | Microcontrollers | 208-BGA (15x15) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, EIA-232, Ethernet, GPIO, HDLC, I2C, SMBus, SPI Peripherals: DMA, POR, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-BGA (15×15) | 20 | |
 | | FIDO1100PQF208IR1 | Analog Devices Inc. | IC MCU 32BIT 32KB RREM 208PQFP | Microcontrollers | 208-PQFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, EIA-232, Ethernet, GPIO, HDLC, I2C, SMBus, SPI Peripherals: DMA, POR, WDT Program Memory Size: 32KB (32K x 8) Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-PQFP (28×28) | 1,398 | |
 | | FIDO5100BBCZ | Analog Devices Inc. | IC ETHERNET SWITCH BGA-144 | Controllers | 144-CSPBGA (10x10) | 1.2V, 3.3V | -40°C ~ 85°C | Standards: IEEE 802.3, 10/100 Base-T/TX PHY Voltage – Supply: 1.2V, 3.3V Operating Temperature: -40°C ~ 85°C Package / Case: 144-LFBGA, CSPBGA Supplier Device Package: 144-CSPBGA (10×10) | 1,554 | |
 | | FIDO5100CBCZ | Analog Devices Inc. | IC ETHERNET SWITCH MII 144BGA | Controllers | 144-CSPBGA (10x10) | 1.2V, 3.3V | -40°C ~ 105°C | Standards: IEEE 802.3, 10/100 Base-T/TX PHY Voltage – Supply: 1.2V, 3.3V Operating Temperature: -40°C ~ 105°C Package / Case: 144-LFBGA, CSPBGA Supplier Device Package: 144-CSPBGA (10×10) | 1,382 | |
 | | FIDO5110BBCZ | Analog Devices Inc. | REM SWITCH SOFTWARE ENABLED | Controllers | 144-CSPBGA (10x10) | 1.08V ~ 1.32V, 2.97V ~ 3.63V | -40°C ~ 85°C | Standards: IEEE 802.3, 10/100 Base-T/TX PHY Voltage – Supply: 1.08V ~ 1.32V, 2.97V ~ 3.63V Operating Temperature: -40°C ~ 85°C Package / Case: 144-LFBGA, CSPBGA Supplier Device Package: 144-CSPBGA (10×10) | 318 | |
 | | FIDO5110CBCZ | Analog Devices Inc. | REM SWITCH SOFTWARE ENABLED | Controllers | 144-CSPBGA (10x10) | 1.08V ~ 1.32V, 2.97V ~ 3.63V | -40°C ~ 105°C | Standards: IEEE 802.3, 10/100 Base-T/TX PHY Voltage – Supply: 1.08V ~ 1.32V, 2.97V ~ 3.63V Operating Temperature: -40°C ~ 105°C Package / Case: 144-LFBGA, CSPBGA Supplier Device Package: 144-CSPBGA (10×10) | 196 | |