Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AFH8065301729602S R1W4IntelIC MPU N2830 2.16GHZ 1170FCBGAMicroprocessors1170-FCBGA (25x27)N/A100°C (TC)
Core Processor:
Intel® Celeron® Processor N2830
Number of Cores/Bus Width:
2 Core, 64-Bit
Speed:
2.16GHz
RAM Controllers:
DDR3L
Graphics Acceleration:
Yes
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage – I/O:
0.4V, 1.14V
Operating Temperature:
100°C (TC)
Security Features:
AES, SecureKey
Mounting Type:
Surface Mount
Package / Case:
1170-BGA, FCBGA
Supplier Device Package:
1170-FCBGA (25×27)
Grade:
Commercial
1,892
FHND001CVABN/AFHND001CVABFlexxonSLC NAND 1GBFlash MemoryN/A2.7 ~ 3.6V0°C - 70°C
Memory Size:
1 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
128M x 8
Memory Interface:
N/A
Grade:
Commercial
Packaging:
9.0x9.0mm FBGA
Qualification:
N/A
1,242
FHND001CVBBN/AFHND001CVBBFlexxonSLC NAND 1GBFlash MemoryN/A2.7 ~ 3.6V0°C - 70°C
Memory Size:
1 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
128M x 8
Memory Interface:
N/A
Grade:
Commercial
Packaging:
6.5x8.0mm FBGA
Qualification:
N/A
1,210
FHND001CVCBN/AFHND001CVCBFlexxonSLC NAND 1GBFlash Memory63-VFBGA2.7 ~ 3.6V0°C - 70°C
Memory Size:
1 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
128M x 8
Memory Interface:
N/A
Grade:
Commercial
Packaging:
9.0x11.0mm FBGA
Qualification:
N/A
1,530
FHND001CVTBN/AFHND001CVTBFlexxonSLC NAND 1GBFlash Memory48-TSOP I2.7 ~ 3.6V0°C - 70°C
Memory Size:
1 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
128M x 8
Memory Interface:
N/A
Grade:
Commercial
Packaging:
12x20mm TSOP
Qualification:
N/A
738
FHND001EVABN/AFHND001EVABFlexxonSLC NAND 1GBFlash MemoryN/A2.7 ~ 3.6V-40°C - 85°C
Memory Size:
1 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
128M x 8
Memory Interface:
N/A
Grade:
Industrial
Packaging:
9.0x9.0mm FBGA
Qualification:
N/A
259
FHND001EVBBN/AFHND001EVBBFlexxonSLC NAND 1GBFlash MemoryN/A2.7 ~ 3.6V-40°C - 85°C
Memory Size:
1 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
128M x 8
Memory Interface:
N/A
Grade:
Industrial
Packaging:
6.5x8.0mm FBGA
Qualification:
N/A
1,369
FHND001EVCBN/AFHND001EVCBFlexxonSLC NAND 1GBFlash Memory63-VFBGA2.7 ~ 3.6V-40°C - 85°C
Memory Size:
1 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
128M x 8
Memory Interface:
N/A
Grade:
Industrial
Packaging:
9.0x11.0mm FBGA
Qualification:
N/A
1,576
FHND001EVTBN/AFHND001EVTBFlexxonSLC NAND 1GBFlash Memory48-TSOP I2.7 ~ 3.6V-40°C - 85°C
Memory Size:
1 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
128M x 8
Memory Interface:
N/A
Grade:
Industrial
Packaging:
12x20mm TSOP
Qualification:
N/A
498
FHND004CVC0N/AFHND004CVC0FlexxonSLC NAND 4GBFlash Memory63-VFBGA2.7 ~ 3.6V0°C - 70°C
Memory Size:
4 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
512M x 8
Memory Interface:
N/A
Grade:
Commercial
Packaging:
9.0x11.0mm FBGA
Qualification:
N/A
357
FHND004CVT0N/AFHND004CVT0FlexxonSLC NAND 4GBFlash Memory48-TSOP I2.7 ~ 3.6V0°C - 70°C
Memory Size:
4 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
512M x 8
Memory Interface:
N/A
Grade:
Commercial
Packaging:
12x20mm TSOP
Qualification:
N/A
757
FHND004EVC0N/AFHND004EVC0FlexxonSLC NAND 4GBFlash Memory63-VFBGA2.7 ~ 3.6V-40°C – 85°C
Memory Size:
4 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
512M x 8
Memory Interface:
N/A
Grade:
Industrial
Packaging:
9.0×11.0mm FBGA
Qualification:
N/A
71
FHND004EVT0N/AFHND004EVT0FlexxonSLC NAND 4GBFlash Memory48-TSOP I2.7 ~ 3.6V-40°C - 85°C
Memory Size:
4 Gbit
Clock Frequency:
N/A
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
SLC
Memory Organization:
512M x 8
Memory Interface:
N/A
Grade:
Industrial
Packaging:
12x20mm TSOP
Qualification:
N/A
1,483
FIDO1100BGA208IR1FIDO1100BGA208IR1Analog Devices Inc.IC MCU 32BIT 32KB RREM 208BGAMicrocontrollers208-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, EIA-232, Ethernet, GPIO, HDLC, I2C, SMBus, SPI
Peripherals:
DMA, POR, WDT
Number of I/O:
72
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
RREM
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (10×10)
Package / Case:
208-TFBGA
1,338
FIDO1100BGB208IR1FIDO1100BGB208IR1Analog Devices Inc.IC MCU 32BIT 32KB RREM 208BGAMicrocontrollers208-BGA (15x15)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, EIA-232, Ethernet, GPIO, HDLC, I2C, SMBus, SPI
Peripherals:
DMA, POR, WDT
Number of I/O:
72
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
RREM
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-BGA (15×15)
Package / Case:
208-TFBGA
20
FIDO1100PQF208IR1FIDO1100PQF208IR1Analog Devices Inc.IC MCU 32BIT 32KB RREM 208PQFPMicrocontrollers208-PQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
CANbus, EBI/EMI, EIA-232, Ethernet, GPIO, HDLC, I2C, SMBus, SPI
Peripherals:
DMA, POR, WDT
Number of I/O:
72
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
RREM
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-PQFP (28×28)
Package / Case:
208-BFQFP
1,398
FIDO5100BBCZFIDO5100BBCZAnalog Devices Inc.IC ETHERNET SWITCH BGA-144Controllers144-CSPBGA (10x10)1.2V, 3.3V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Switch
Interface:
MII, RMII
Standards:
IEEE 802.3, 10/100 Base-T/TX PHY
Voltage – Supply:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 85°C
Package / Case:
144-LFBGA, CSPBGA
Supplier Device Package:
144-CSPBGA (10×10)
1,554
FIDO5100CBCZFIDO5100CBCZAnalog Devices Inc.IC ETHERNET SWITCH MII 144BGAControllers144-CSPBGA (10x10)1.2V, 3.3V-40°C ~ 105°C
Protocol:
Ethernet
Function:
Switch
Interface:
MII, RMII
Standards:
IEEE 802.3, 10/100 Base-T/TX PHY
Voltage – Supply:
1.2V, 3.3V
Operating Temperature:
-40°C ~ 105°C
Package / Case:
144-LFBGA, CSPBGA
Supplier Device Package:
144-CSPBGA (10×10)
1,382
FIDO5110BBCZFIDO5110BBCZAnalog Devices Inc.REM SWITCH SOFTWARE ENABLEDControllers144-CSPBGA (10x10)1.08V ~ 1.32V, 2.97V ~ 3.63V-40°C ~ 85°C
Protocol:
Ethernet
Function:
Switch
Interface:
MII, RMII
Standards:
IEEE 802.3, 10/100 Base-T/TX PHY
Voltage – Supply:
1.08V ~ 1.32V, 2.97V ~ 3.63V
Current – Supply:
48mA
Operating Temperature:
-40°C ~ 85°C
Package / Case:
144-LFBGA, CSPBGA
Supplier Device Package:
144-CSPBGA (10×10)
318
FIDO5110CBCZFIDO5110CBCZAnalog Devices Inc.REM SWITCH SOFTWARE ENABLEDControllers144-CSPBGA (10x10)1.08V ~ 1.32V, 2.97V ~ 3.63V-40°C ~ 105°C
Protocol:
Ethernet
Function:
Switch
Interface:
MII, RMII
Standards:
IEEE 802.3, 10/100 Base-T/TX PHY
Voltage – Supply:
1.08V ~ 1.32V, 2.97V ~ 3.63V
Current – Supply:
48mA
Operating Temperature:
-40°C ~ 105°C
Package / Case:
144-LFBGA, CSPBGA
Supplier Device Package:
144-CSPBGA (10×10)
196

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