Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
HD64F3687GFPVHD64F3687GFPVRenesasIC MCU 16BIT 56KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
160
HD64F3687GHVHD64F3687GHVRenesasIC MCU 16BIT 56KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
45
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
6
HD64F3687HVHD64F3687HVRenesasIC MCU 16BIT 56KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
45
Program Memory Size:
56KB (56K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,788
HD64F36912GFHWVTRHD64F36912GFHWVTRRenesasIC MCU 16BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
12MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
18
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1.5K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,303
HD64F3694FPIVHD64F3694FPIVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,365
HD64F3694FPJHD64F3694FPJRenesas16-BIT, FLASH, H8MicroprocessorsQFPN/A-20 °C – 75 °C
Speed:
20 MHz
Voltage – I/O:
5 V
Core Processor:
H8
Number of Cores/Bus Width:
1 Core, 16-Bit
Graphics Acceleration:
No
Qualification:
Consumer
620
HD64F3694FPJEHD64F3694FPJERenesas16-BIT, FLASH, H8MicroprocessorsQFPN/A-20 °C – 75 °C
Speed:
20 MHz
Voltage – I/O:
5 V
Core Processor:
H8
Number of Cores/Bus Width:
1 Core, 16-Bit
Graphics Acceleration:
No
Qualification:
Consumer
344
HD64F3694FPJVHD64F3694FPJVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
373
HD64F3694FPVHD64F3694FPVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
992
HD64F3694FXVHD64F3694FXVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (10×10)
Package / Case:
48-LQFP
1,434
HD64F3694FYIVHD64F3694FYIVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
1,300
HD64F3694FYJEHD64F3694FYJERenesas16-BIT, FLASH, H8MicroprocessorsQFPN/A-20 °C – 75 °C
Speed:
20 MHz
Voltage – I/O:
5 V
Core Processor:
H8
Number of Cores/Bus Width:
1 Core, 16-Bit
Graphics Acceleration:
No
Qualification:
Consumer
514
HD64F3694FYVHD64F3694FYVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
3
HD64F3694GFPIVHD64F3694GFPIVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
327
HD64F3694GFPVHD64F3694GFPVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
706
HD64F3694GFTVHD64F3694GFTVRenesasIC MCU 16BIT 32KB FLASH 48VQFNMicrocontrollers48-VQFN (7x7)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-VQFN (7×7)
Package / Case:
48-VFQFN
1,357
HD64F3694GFXVHD64F3694GFXVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (10×10)
Package / Case:
48-LQFP
665
HD64F3694GFYVHD64F3694GFYVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
828
HD64F3694GHVHD64F3694GHVRenesasIC MCU 16BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,079
HD64F3694HJHD64F3694HJRenesas16-BIT, FLASH, H8MicroprocessorsQFPN/A-20 °C – 75 °C
Speed:
20 MHz
Voltage – I/O:
5 V
Core Processor:
H8
Number of Cores/Bus Width:
1 Core, 16-Bit
Graphics Acceleration:
No
Qualification:
Consumer
445

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