 | | K32L3A60VPJ1AT | NXP Semiconductors | IC MCU 32B 1.25MB FLASH 176VFBGA | Microcontrollers | 176-VFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0+ Core Size: 32-Bit Dual-Core Connectivity: FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: AC’97, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-VFBGA (9×9) | 763 | |
| N/A | N/A | K32W022S1M2VPJAT | NXP Semiconductors | MCU BT5/FSK/THREAD 176-VFBGA | Microcontrollers | 176-VFBGA | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Supplier Device Package: 176-VFBGA | 401 | |
| N/A | N/A | K32W032S1M2CAVAR | NXP Semiconductors | MCU KINETIS BT5/FSK WLCSP | Microcontrollers | 191-WLCSP (5.97x5.85) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 191-WLCSP (5.97×5.85) | 678 | |
| N/A | N/A | K32W032S1M2VPJAT | NXP Semiconductors | MCU KINETIS BT5/FSK 176-VFBGA | Microcontrollers | 176-VFBGA | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Supplier Device Package: 176-VFBGA | 569 | |
| N/A | N/A | K32W042S1M2CAVAR | NXP Semiconductors | MCU KINETIS BT5/FSK/THREAD WLCSP | Microcontrollers | 191-WLCSP (5.97x5.85) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 191-WLCSP (5.97×5.85) | 877 | |
| N/A | N/A | K32W042S1M2VPJAT | NXP Semiconductors | MCU KINETIS THREAD 176-VFBGA | Microcontrollers | 176-VFBGA | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Program Memory Size: 1.25MB (1.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 12bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Supplier Device Package: 176-VFBGA | 792 | |
 | | K4S510432D-UC75 | Samsung Semiconductor, Inc. | IC DRAM 512MBIT LVTTL 54TSOP II | DRAM Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Organization: 128M x 4 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 1,363 | |
 | | K4S510432D-UC75T00 | Samsung Semiconductor, Inc. | IC DRAM 512MBIT LVTTL 54TSOP II | DRAM Memory | 54-TSOP II | 3V ~ 3.6V | 0°C ~ 70°C (TA) | Memory Organization: 128M x 4 Packaging: 54-TSOP (0.400", 10.16mm Width) Write Cycle Time Word Page: N/A | 1,582 | |
 | N/A | K9S08SG16E1MTG | NXP Semiconductors | SAMPLE PACK DEVICE | Microcontrollers | N/A | N/A | N/A | N/A | 613 | |
 | N/A | KAP-UA9636ACP | Texas Instruments | IC ANALOG INTERFACE | Drivers, Receivers, Transceivers | N/A | N/A | N/A | N/A | 207 | |
| N/A | | KC13213 | NXP Semiconductors | 2.4GHz 802.15.4 ZigBee SoC, HCS08, 60KB Flash | Microprocessors | 71-LGA (9x9) | N/A | -40 °C – 85 °C (TA) | Voltage – I/O: 2.0 V – 3.4 V Number of Cores/Bus Width: 1 Core, 8-Bit | 95 | |
 | | KC56F8246MLF | NXP Semiconductors | MC56F8246MLF - Microcontroller, | Microcontrollers | N/A | N/A | N/A | N/A | 1,579 | |
| N/A | | KC80524KX266256 | Intel | IC MPU INTEL PENT 266MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | 0°C ~ 100°C (TC) | Core Processor: Intel® Pentium® 4 Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 100°C (TC) Mounting Type: Surface Mount Supplier Device Package: 615-PBGA | 731 | |
| N/A | | KC80524KX333256 | Intel | IC MPU MOBL PENT 333MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | – | Core Processor: Mobile Intel® Pentium® II Number of Cores/Bus Width: 1 Core Mounting Type: Surface Mount Supplier Device Package: 615-PBGA | 1,877 | |
| N/A | | KC80524KX366128 | Intel | IC MPU MOBILE CEL 366MHZ PBGA615 | Microprocessors | 615-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Celeron® Number of Cores/Bus Width: 1 Core Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 615-PBGA | 1,282 | |
 | | KC80524KX366128SL3C7 | Intel | IC MPU MOBILE CEL 366MHZ 615BGA | Microprocessors | 615-BGA (35.15x31.15) | N/A | 0°C ~ 100°C (TJ) | Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 615-BGA (35.15×31.15) | 1,547 | |
| N/A | | KC80526GY650256 | Intel | IC MPU MOBIL PENT 650MHZ PBGA495 | Microprocessors | 495-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Pentium® III Number of Cores/Bus Width: 1 Core, 32-Bit Voltage – I/O: 1.35V, 1.6V Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 495-PBGA | 1,184 | |
| N/A | | KC80526GY6504JY | Intel | RISC MPU, 32-BIT, 600MHZ | Microprocessors | 495-BGA | N/A | 0 °C – 80 °C | Core Processor: Intel® Pentium® III Processor Number of Cores/Bus Width: 1 Core, 32-Bit | 310 | |
| N/A | | KC80526LY400128 | Intel | IC MPU MOBIL PENT 400MHZ 495BGA | Microprocessors | 495-BGA (31x27) | N/A | – | Core Processor: Mobile Intel® Celeron® Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount Supplier Device Package: 495-BGA (31×27) | 713 | |
| N/A | | KC80526LY500256 | Intel | IC MPU MOBIL PENT 500MHZ PBGA495 | Microprocessors | 495-PBGA | N/A | 100°C (TJ) | Core Processor: Mobile Intel® Pentium® III Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 100°C (TJ) Mounting Type: Surface Mount Supplier Device Package: 495-PBGA | 937 | |