Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
LM3S8971-EQC50-A2TLM3S8971-EQC50-A2TTexas InstrumentsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, Ethernet, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
673
LM3S8971-IBZ50-A2LM3S8971-IBZ50-A2Texas InstrumentsIC MCU 32BIT 256KB FLASH 108BGAMicrocontrollers108-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, Ethernet, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
108-BGA (10×10)
Package / Case:
108-LFBGA
1,785
LM3S8971-IBZ50-A2TLM3S8971-IBZ50-A2TTexas InstrumentsIC MCU 32BIT 256KB FLASH 108BGAMicrocontrollers108-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, Ethernet, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
108-BGA (10×10)
Package / Case:
108-LFBGA
315
LM3S8971-IQC50-A2LM3S8971-IQC50-A2Texas InstrumentsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, Ethernet, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,624
LM3S8971-IQC50-A2TLM3S8971-IQC50-A2TTexas InstrumentsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
CANbus, Ethernet, IrDA, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
695
LM3S8C62-IQC80-A1LM3S8C62-IQC80-A1Texas InstrumentsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
543
LM3S8C62-IQC80-A2LM3S8C62-IQC80-A2Texas InstrumentsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,204
LM3S8C62-IQC80-A2TLM3S8C62-IQC80-A2TTexas InstrumentsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
186
LM3S8G62-IBZ80-A2TLM3S8G62-IBZ80-A2TTexas InstrumentsIC MCU 32BIT 384KB FLASH 108BGAMicrocontrollers108-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
108-BGA (10×10)
Package / Case:
108-LFBGA
846
LM3S8G62-IQC80-A1N/ALM3S8G62-IQC80-A1Texas InstrumentsIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
323
LM3S8G62-IQC80-A1TN/ALM3S8G62-IQC80-A1TTexas InstrumentsIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
480
LM3S8G62-IQC80-A2LM3S8G62-IQC80-A2Texas InstrumentsIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,081
LM3S8G62-IQC80-A2TLM3S8G62-IQC80-A2TTexas InstrumentsIC MCU 32BIT 384KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
303
LM3S9790-IBZ80-C1LM3S9790-IBZ80-C1Texas InstrumentsIC MCU 32BIT 128KB FLASH 108BGAMicrocontrollers108-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.235V ~ 1.365V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
108-BGA (10×10)
Package / Case:
108-LFBGA
267
LM3S9790-IBZ80-C3LM3S9790-IBZ80-C3Texas InstrumentsIC MCU 32BIT 128KB FLASH 108BGAMicrocontrollers108-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.235V ~ 1.365V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
108-BGA (10×10)
Package / Case:
108-LFBGA
717
LM3S9790-IBZ80-C5LM3S9790-IBZ80-C5Texas InstrumentsIC MCU 32BIT 128KB FLASH 108BGAMicrocontrollers108-BGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.235V ~ 1.365V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
108-BGA (10×10)
Package / Case:
108-LFBGA
736
LM3S9790-IQC80-C3LM3S9790-IQC80-C3Texas InstrumentsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.235V ~ 1.365V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,910
LM3S9790-IQC80-C5LM3S9790-IQC80-C5Texas InstrumentsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.235V ~ 1.365V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,236
LM3S9790-IQC80-C5TLM3S9790-IQC80-C5TTexas InstrumentsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
60
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.235V ~ 1.365V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
298
LM3S9792-IQC80-C5LM3S9792-IQC80-C5Texas InstrumentsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, Microwire, QEI, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
65
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
1.235V ~ 1.365V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
689

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