Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
LPC1766FBD100,551N/ALPC1766FBD100,551NXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
840
LPC1766FBD100KLPC1766FBD100KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,601
LPC1767FBD100,551LPC1767FBD100,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,195
LPC1767FBD100KLPC1767FBD100KNXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
I2C, IrDA, Microwire, SPI, SSI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
712
LPC1768FBD100,551LPC1768FBD100,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
294
LPC1768FBD100KLPC1768FBD100KNXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
158
N/ALPC1768FBD100YNXP SemiconductorsIC MCU 32BIT 512KB FLSH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
180
LPC1768FET100,551LPC1768FET100,551NXP SemiconductorsIC MCU 32BIT 512KB FLSH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
328
LPC1768FET100YLPC1768FET100YNXP SemiconductorsIC MCU 32BIT 512KB FLSH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
10
LPC1768FET100ZLPC1768FET100ZNXP SemiconductorsIC MCU 32BIT 512KB FLSH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
569
LPC1768UKJLPC1768UKJNXP SemiconductorsIC MCU 32BIT 512KB FLSH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
1,425
LPC1768UKZLPC1768UKZNXP SemiconductorsIC MCU 32BIT 512KB FLSH 100WLCSPMicrocontrollers100-WLCSP (5.07x5.07)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-WLCSP (5.07×5.07)
Package / Case:
100-UFBGA, WLCSP
1,038
LPC1769FBD100,551LPC1769FBD100,551NXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,803
N/ALPC1769FBD100/P1KNXP SemiconductorsLPC17xx - 512kB flash, 64kB SRAMMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x10b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
207
LPC1769FBD100KLPC1769FBD100KNXP SemiconductorsIC MCU 32BIT 512KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
64K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
368
LPC1774FBD144,551LPC1774FBD144,551NXP SemiconductorsIC MCU 32BIT 128KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
109
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
633
LPC1774FBD208,551LPC1774FBD208,551NXP SemiconductorsIC MCU 32BIT 128KB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
165
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
40K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
637
LPC1776FBD208,551LPC1776FBD208,551NXP SemiconductorsIC MCU 32BIT 256KB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
165
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,113
LPC1776FBD208KLPC1776FBD208KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
165
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
1,700
LPC1776FET180,551LPC1776FET180,551NXP SemiconductorsIC MCU 32BIT 256KB FLSH 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
141
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
80K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 8x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,351

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