 | | LPC43S20FBD144E | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 824 | |
 | | LPC43S20FET180E | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 507 | |
 | | LPC43S20FET180K | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b;D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,251 | |
 | | LPC43S30FBD144E | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,537 | |
 | | LPC43S30FET100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 892 | |
 | | LPC43S30FET100K | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b SAR; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 1,671 | |
 | | LPC43S30FET256E | NXP Semiconductors | IC MCU 32BIT ROMLESS 256LBGA | Microcontrollers | 256-LBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LBGA (17×17) | 652 | |
 | | LPC43S37JBD144E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 569 | |
 | | LPC43S37JET100E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 4x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 1,925 | |
 | | LPC43S50FET180E | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 903 | |
 | | LPC43S50FET256,551 | NXP Semiconductors | IC MCU 32BIT ROMLESS 256LBGA | Microcontrollers | 256-LBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LBGA (17×17) | 49 | |
 | | LPC43S57JBD208E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 643 | |
 | | LPC43S57JET256E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 256LBGA | Microcontrollers | 256-LBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 8x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LBGA (17×17) | 1,255 | |
 | | LPC43S67JBD208E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 16x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 682 | |
 | | LPC43S67JET100E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 16x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 204 | |
 | | LPC43S67JET256E | NXP Semiconductors | IC MCU 32BIT 1MB FLASH 256LBGA | Microcontrollers | 256-LBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 16x10b; D/A 1x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LBGA (17×17) | 89 | |
 | | LPC43S70FET100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 16x10b, 6x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 505 | |
 | | LPC43S70FET256E | NXP Semiconductors | IC MCU 32BIT ROMLESS 256LBGA | Microcontrollers | 256-LBGA (17x17) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4/M0 Core Size: 32-Bit Dual-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 2.2V ~ 3.6V Data Converters: A/D 3x12b; D/A 1x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 256-LBGA (17×17) | 1,094 | |
 | | LPC51U68JBD48E | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 486 | |
 | | LPC51U68JBD48K | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: USART, SPIs, I2C, USB Peripherals: Brown-out Detect/Reset, POR, PWM, WDT, DMA Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.62V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,923 | |