Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
LPC43S20FBD144ELPC43S20FBD144ENXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
824
LPC43S20FET180ELPC43S20FET180ENXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
118
Program Memory Type:
ROMless
RAM Size:
264K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
507
LPC43S20FET180KLPC43S20FET180KNXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
118
Program Memory Type:
ROMless
RAM Size:
200K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b;D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
1,251
LPC43S30FBD144ELPC43S30FBD144ENXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
83
Program Memory Type:
ROMless
RAM Size:
264K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,537
LPC43S30FET100ELPC43S30FET100ENXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
264K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
892
LPC43S30FET100KLPC43S30FET100KNXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
264K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b SAR; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
1,671
LPC43S30FET256ELPC43S30FET256ENXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
264K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
652
LPC43S37JBD144ELPC43S37JBD144ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
83
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
569
LPC43S37JET100ELPC43S37JET100ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 4x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
1,925
LPC43S50FET180ELPC43S50FET180ENXP SemiconductorsIC MCU 32BIT ROMLESS 180TFBGAMicrocontrollers180-TFBGA (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
118
Program Memory Type:
ROMless
RAM Size:
264K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
180-TFBGA (12×12)
Package / Case:
180-TFBGA
903
LPC43S50FET256,551LPC43S50FET256,551NXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
264K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
49
LPC43S57JBD208ELPC43S57JBD208ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Number of I/O:
142
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
643
LPC43S57JET256ELPC43S57JET256ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, Motor Control PWM, POR, WDT
Number of I/O:
164
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
136K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
1,255
LPC43S67JBD208ELPC43S67JBD208ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 208LQFPMicrocontrollers208-LQFP (28x28)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
142
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
154K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
208-LQFP (28×28)
Package / Case:
208-LQFP
682
LPC43S67JET100ELPC43S67JET100ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
154K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
204
LPC43S67JET256ELPC43S67JET256ENXP SemiconductorsIC MCU 32BIT 1MB FLASH 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
164
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
EEPROM Size:
16K x 8
RAM Size:
154K x 8
Voltage – Supply (Vcc/Vdd):
2.4V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
89
LPC43S70FET100ELPC43S70FET100ENXP SemiconductorsIC MCU 32BIT ROMLESS 100TFBGAMicrocontrollers100-TFBGA (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, WDT
Number of I/O:
49
Program Memory Type:
ROMless
RAM Size:
282K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 16x10b, 6x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TFBGA (9×9)
Package / Case:
100-TFBGA
505
LPC43S70FET256ELPC43S70FET256ENXP SemiconductorsIC MCU 32BIT ROMLESS 256LBGAMicrocontrollers256-LBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
204MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, MMC/SD, QEI, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
164
Program Memory Type:
ROMless
RAM Size:
282K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 3.6V
Data Converters:
A/D 3x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
256-LBGA (17×17)
Package / Case:
256-LBGA
1,094
LPC51U68JBD48ELPC51U68JBD48ENXP SemiconductorsIC MCU 32BIT 256KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
Flexcomm, I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
486
LPC51U68JBD48KLPC51U68JBD48KNXP SemiconductorsIC MCU 32BIT 256KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
USART, SPIs, I2C, USB
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT, DMA
Number of I/O:
37
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
1.62V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,923

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