 | | LPC54618J512ET180E | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,404 | |
 | | LPC54628J512ET180E | NXP Semiconductors | IC MCU 32BIT 512KB FLSH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,206 | |
 | | LPC54S005JBD100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,171 | |
 | | LPC54S005JET100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100TFBGA | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 12 | |
| N/A | N/A | LPC54S016JBD100 | NXP Semiconductors | IC MCU 32BIT ROMLESS 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 966 | |
 | | LPC54S016JBD100E | NXP Semiconductors | IC MCU 32BIT ROMLESS 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 62 | |
| N/A | | LPC54S016JBD100Y | NXP Semiconductors | POWER-EFFICIENT MICROCONTROLLERS | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 344 | |
 | | LPC54S016JBD208E | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 1,388 | |
| N/A | | LPC54S016JET100E | NXP Semiconductors | LPC54S016 - Power-Efficient Micr | Microcontrollers | 100-TFBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-TFBGA (9×9) | 1,759 | |
| N/A | N/A | LPC54S016JET180 | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 340 | |
 | | LPC54S016JET180E | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,671 | |
 | | LPC54S018J2MET180E | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,844 | |
 | | LPC54S018J4MET180E | NXP Semiconductors | IC MCU 32BIT 4MB FLASH 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 1,847 | |
 | | LPC54S018JBD208E | NXP Semiconductors | IC MCU 32BIT ROMLESS 208LQFP | Microcontrollers | 208-LQFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-LQFP (28×28) | 951 | |
 | | LPC54S018JET180E | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 417 | |
 | | LPC54S018JET180K | NXP Semiconductors | IC MCU 32BIT ROMLESS 180TFBGA | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 39 | |
| N/A | | LPC54S018JET180Y | NXP Semiconductors | POWER-EFFICIENT MICROCONTROLLERS | Microcontrollers | 180-TFBGA (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 180-TFBGA (12×12) | 477 | |
 | | LPC5502JBD64E | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 1,048 | |
| N/A | | LPC5502JBD64K | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64TQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 1,420 | |
| N/A | | LPC5502JBD64Y | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64TQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 9x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 544 | |