Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
M30624FGPGP#U7CM30624FGPGP#U7CRenesasIC MCU 16BIT 256KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
784
M30624FGPGP#U9CM30624FGPGP#U9CRenesasIC MCU 16BIT 256KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
843
M30624FGTGP#UTQM30624FGTGP#UTQRenesas16-BIT, FLASH, M16C CPUMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
888
M30624MGP-XXXGP#33M30624MGP-XXXGP#33RenesasIC MCU 16B 256KB MASK ROM 100QFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
87
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Mask ROM
EEPROM Size:
4K x 8
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
231
M30624SPFP#U3CM30624SPFP#U3CRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
50
Program Memory Type:
ROMless
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
668
M30624SPFP#U5CM30624SPFP#U5CRenesasIC MCU 16BIT ROMLESS 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
50
Program Memory Type:
ROMless
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
493
M30624SPGP#U3CM30624SPGP#U3CRenesasIC MCU 16BIT ROMLESS 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
50
Program Memory Type:
ROMless
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
234
M30624SPGP#U5CM30624SPGP#U5CRenesasIC MCU 16BIT ROMLESS 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
50
Program Memory Type:
ROMless
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
800
M30625FGAGP#U3M30625FGAGP#U3Renesas16-BIT, FLASH, M16C CPUMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
710
M30625FGAGP#U5M30625FGAGP#U5Renesas16-BIT, FLASH, M16C CPUMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,038
M30625FGMGP#U3M30625FGMGP#U3Renesas16-BIT, FLASH, M16C CPUMicrocontrollers128-LFQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
113
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LFQFP (14×20)
Package / Case:
128-LQFP
1,065
M30625FGPGP#U3CM30625FGPGP#U3CRenesasIC MCU 16BIT 256KB FLASH 128LQFPMicrocontrollers128-LFQFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
113
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LFQFP (14×20)
Package / Case:
128-LQFP
161
M30625FGPGP#U5CM30625FGPGP#U5CRenesasIC MCU 16BIT 256KB FLSH 128LFQFPMicrocontrollers128-LFQFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
113
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LFQFP (14×20)
Package / Case:
128-LQFP
25
M30625FGPGP#U9CM30625FGPGP#U9CRenesasIC MCU 16BIT 256KB FLASH 128LQFPMicrocontrollers128-LFQFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
113
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
20K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LFQFP (14×20)
Package / Case:
128-LQFP
21
M30626FHPFPM30626FHPFPRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
87
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
31K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
1,814
M30626FHPFP#U3CM30626FHPFP#U3CRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
31K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
1,238
M30626FHPFP#U5CM30626FHPFP#U5CRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
31K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
571
M30626FHPFP#U7CM30626FHPFP#U7CRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
31K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
513
M30626FHPFP#U9CM30626FHPFP#U9CRenesasIC MCU 16BIT 384KB FLASH 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
85
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
31K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
1,206
M30626FHPGP#33CM30626FHPGP#33CRenesasIC MCU 16BIT 384KB FLSH 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M16C/60
Core Size:
16-Bit
Speed:
24MHz
Connectivity:
I2C, IEBus, UART/USART
Peripherals:
DMA, WDT
Number of I/O:
87
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
31K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
175

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