Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
M3083LFJVGP#U0M3083LFJVGP#U0RenesasMICROCONTROLLER, 32-BIT, FLASH,MicrocontrollersN/AN/AN/A

N/A

742
M30840SGP#35M30840SGP#35RenesasIC MCU 16/32BIT ROMLESS 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
123
Program Memory Type:
ROMless
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 34x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1
M30840SGP#U5M30840SGP#U5RenesasIC MCU 16/32BIT ROMLESS 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
45
Program Memory Type:
ROMless
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 10x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,503
M30842SGP#U5M30842SGP#U5RenesasIC MCU 16/32BIT ROMLESS 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
81
Program Memory Type:
ROMless
RAM Size:
10K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 34x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
1,064
M30843FHFP#U3M30843FHFP#U3RenesasIC MCU 16/32B 384KB FLASH 100QFPMicrocontrollers100-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
589
M30843FHFP#U5M30843FHFP#U5RenesasIC MCU 16/32B 384KB FLASH 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
1,066
M30843FHGP#35M30843FHGP#35RenesasIC MCU 16/32BT 384KB FLSH 100QFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,066
M30843FHGP#U3N/AM30843FHGP#U3RenesasIC MCU 16/32BIT 384KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,156
M30843FHGP#U5M30843FHGP#U5RenesasIC MCU 16/32BIT 384KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,090
M30843FJFP#U3M30843FJFP#U3RenesasIC MCU 16/32B 512KB FLASH 100QFPMicrocontrollers100-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
923
M30843FJGP#35M30843FJGP#35RenesasIC MCU 16/32BT 512KB FLSH 100QFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
182
M30843FJGP#U3M30843FJGP#U3RenesasIC MCU 16/32B 512KB FLSH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
15
M30843FJGP#U5M30843FJGP#U5RenesasIC MCU 16/32B 512KB FLSH 100LQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
1,529
M30843FWGP#35M30843FWGP#35RenesasIC MCU 16/32BT 320KB FLSH 100QFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Size:
320KB (320K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
980
M30843FWGP#U3M30843FWGP#U3RenesasIC MCU 16/32BIT 320KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
320KB (320K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
693
M30843FWGP#U5M30843FWGP#U5RenesasIC MCU 16/32BIT 320KB 100LFQFPMicrocontrollers100-LFQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
85
Program Memory Size:
320KB (320K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LFQFP (14×14)
Package / Case:
100-LQFP
90
M30843MW-XXXFPN/AM30843MW-XXXFPRenesasIC MCU 16/32BIT 320KB 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Size:
320KB (320K x 8)
Program Memory Type:
Mask ROM
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
197
M30843MW-XXXFP#U0N/AM30843MW-XXXFP#U0RenesasIC MCU 16/32BIT 320KB 100QFPMicrocontrollers100-QFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
87
Program Memory Size:
320KB (320K x 8)
Program Memory Type:
Mask ROM
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 26x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×20)
Package / Case:
100-BQFP
796
M30845FHGP#U3M30845FHGP#U3RenesasIC MCU 16/32BIT 384KB 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
121
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 34x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
817
M30845FJGP#D5M30845FJGP#D5RenesasIC MCU 16/32BIT 512KB 144LFQFPMicrocontrollers144-LFQFP (20x20)N/A-20°C ~ 85°C
Core Processor:
M32C/80
Core Size:
16/32-Bit
Speed:
32MHz
Connectivity:
CANbus, I2C, IEBus, SIO, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
121
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 34x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
144-LFQFP (20×20)
Package / Case:
144-LQFP
674

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