Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
M37911FGCHPM37911FGCHPRenesasIC MCU 16BIT 120KB FLASH 80LQFPMicrocontrollers80-LQFP (12x12)N/A-20°C ~ 85°C (TA)
Core Processor:
7700
Core Size:
16-Bit
Speed:
40MHz
Connectivity:
UART/USART
Peripherals:
WDT
Number of I/O:
11
Program Memory Size:
120KB (120K x 8)
Program Memory Type:
FLASH
RAM Size:
3.875K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
476
M38002E2FPM38002E2FPRenesas8-BIT, UVPROM, MELPS740 CPUMicrocontrollersN/AN/AN/A

N/A

1,047
N/AM38002E4FS#E5RenesasIC MCU 8BIT 16KB EPROM/UV 64QFNMicrocontrollers64-QFN (15.6x15.6)N/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SIO, UART/USART
Peripherals:
WDT
Number of I/O:
58
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
EPROM, UV
RAM Size:
384 x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Oscillator Type:
External
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN (15.6×15.6)
Package / Case:
64-BQFN
1,241
M38004E8SPM38004E8SPRenesas8-BIT, UVPROM, MELPS740 CPUMicrocontrollersN/AN/AN/A

N/A

1,373
N/AM38004E8SSRenesas8-BIT, UVPROM, MELPS740 CPUMicrocontrollersN/AN/AN/A

N/A

634
N/AM38022E4SPRenesas8-BIT, 740/3802 CPUMicrocontrollersN/AN/AN/A

N/A

295
N/AM38039FFHSP#U0RenesasIC MCU 8BIT 60KB FLASH 64SDIPMicrocontrollers64-SDIPN/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
16.8MHz
Connectivity:
SIO, UART/USART
Peripherals:
LED, PWM, WDT
Number of I/O:
56
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SDIP
Package / Case:
64-SDIP (0.750″”, 19.05mm)
1,322
M38039FFLHP#U0M38039FFLHP#U0RenesasIC MCU 8BIT 60KB FLASH 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
16.8MHz
Connectivity:
SIO, UART/USART
Peripherals:
LED, PWM, WDT
Number of I/O:
56
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
211
M38039FFLKP#U0M38039FFLKP#U0RenesasIC MCU 8BIT 60KB FLASH 64LQFPMicrocontrollers64-LQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
16.8MHz
Connectivity:
SIO, UART/USART
Peripherals:
LED, PWM, WDT
Number of I/O:
56
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (14×14)
Package / Case:
64-LQFP
1,487
M38039FFLKP#Y1M38039FFLKP#Y1RenesasIC MCU 8BIT 60KB FLASH 64LQFPMicrocontrollers64-LQFP (14x14)N/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
16.8MHz
Connectivity:
SIO, UART/USART
Peripherals:
LED, PWM, WDT
Number of I/O:
56
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (14×14)
Package / Case:
64-LQFP
622
N/AM38039G4HSP#U0RenesasIC MCU 8BIT 16KB QZROM 64SDIPMicrocontrollers64-SDIPN/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
16.8MHz
Connectivity:
SIO, UART/USART
Peripherals:
LED, PWM, WDT
Number of I/O:
56
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
QzROM
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SDIP
Package / Case:
64-SDIP (0.750″”, 19.05mm)
829
M38039G6HHP#U0M38039G6HHP#U0RenesasIC MCU 8BIT 24KB QZROM 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
16.8MHz
Connectivity:
SIO, UART/USART
Peripherals:
LED, PWM, WDT
Number of I/O:
56
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
QzROM
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
1,892
M38039GCHHP#U0M38039GCHHP#U0RenesasIC MCU 8BIT 48KB QZROM 64LFQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
16.8MHz
Connectivity:
SIO, UART/USART
Peripherals:
LED, PWM, WDT
Number of I/O:
56
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
QzROM
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
988
N/AM38049FFHHP#W4RenesasMICROCONTROLLER, 8 BIT, FLASH, MMicrocontrollersN/AN/AN/A

N/A

190
N/AM38049FFHP#U0RenesasMICROCONTROLLER 8BIT GENERAL /MicrocontrollersN/AN/AN/A

N/A

677
N/AM38049FFLSP#U0Renesas8-BIT, FLASH, MELPS740 CPUMicrocontrollers64-SDIPN/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
16.8MHz
Connectivity:
I2C, UART/USART
Peripherals:
PWM, WDT
Number of I/O:
56
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b; D/A 2x8b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SDIP
Package / Case:
64-SDIP (0.750″”, 19.05mm)
1,328
M38067E8FPM38067E8FPRenesas8-BIT, OTPROM, MELPS740 CPUMicrocontrollersN/AN/AN/A

N/A

161
M38067ECAFPM38067ECAFPRenesas8-BIT, OTPROM, MELPS740 CPUMicrocontrollersN/AN/AN/A

N/A

1,723
N/AM38067ECAFSRenesasIC MCU 8BIT 48KB EPROM/UVMicrocontrollersN/AN/A-20°C ~ 85°C (TA)
Core Processor:
740
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
SIO, UART/USART
Number of I/O:
72
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
EPROM, UV
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x8b; D/A 2x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
80-CLCC
535
N/AM38079EFFSRenesasIC MCU 16BIT 60KB OTP 80QFPMicrocontrollers80-QFP (14x20)N/A-20°C ~ 85°C (TA)
Core Processor:
H8/300
Core Size:
16-Bit
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×20)
Package / Case:
80-BQFP
1,535

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