Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MAX251CSD+TMAX251CSD+TAnalog Devices Inc.IC TRANSCEIVER FULL 2/2 14SOICDrivers, Receivers, Transceivers14-SOIC4.5V ~ 5.5V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
600 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
1,087
MAX251EJDMAX251EJDAnalog Devices Inc.IC TRANSCEIVER FULL 2/2 14CDIPDrivers, Receivers, Transceivers14-CDIP4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
600 mV
Data Rate:
116Kbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Through Hole
Package / Case:
14-CDIP (0.300″”, 7.62mm)
Supplier Device Package:
14-CDIP
472
MAX251EPDMAX251EPDAnalog Devices Inc.IC TRANSCEIVER FULL 2/2 14DIPDrivers, Receivers, Transceivers14-PDIP4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
600 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Through Hole
Package / Case:
14-DIP (0.300″”, 7.62mm)
Supplier Device Package:
14-PDIP
1,705
MAX251EPD+MAX251EPD+Analog Devices Inc.IC TRANSCEIVER FULL 2/2 14DIPDrivers, Receivers, Transceivers14-PDIP4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
600 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Through Hole
Package / Case:
14-DIP (0.300″”, 7.62mm)
Supplier Device Package:
14-PDIP
1,632
MAX251ESDMAX251ESDAnalog Devices Inc.IC TRANSCEIVER FULL 2/2 14SOICDrivers, Receivers, Transceivers14-SOIC4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
600 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
270
MAX251ESD+MAX251ESD+Analog Devices Inc.IC TRANSCEIVER FULL 2/2 14SOICDrivers, Receivers, Transceivers14-SOIC4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
600 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
498
MAX251ESD+TMAX251ESD+TAnalog Devices Inc.IC TRANSCEIVER FULL 2/2 14SOICDrivers, Receivers, Transceivers14-SOIC4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
600 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
833
MAX251ESD+TG071MAX251ESD+TG071Analog Devices Inc.IC TRANSCEIVER FULL 2/2 14SOICDrivers, Receivers, Transceivers14-SOIC4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
600 mV
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
343
N/AN/AMAX252ACHLAnalog Devices Inc.IC DUAL RS232 TRANS MOD 40-DIPDrivers, Receivers, TransceiversModuleN/AN/A
Mounting Type:
Through Hole
Package / Case:
40-DIP Module
Supplier Device Package:
Module
3
N/AN/AMAX28200EWC+TAnalog Devices Inc.IC MCU 16BIT 16KB FLASH 12WLPMicrocontrollers12-WLP (1.67x1.77)N/A-40°C ~ 85°C (TA)
Core Processor:
MAXQ
Core Size:
16-Bit
Connectivity:
I2C
Peripherals:
PWM, WDT
Number of I/O:
4
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
12-WLP (1.67×1.77)
Package / Case:
12-XFBGA, WLBGA
1,238
N/AN/AMAX28200EWC+UAnalog Devices Inc.IC MCU 16BIT 16KB FLASH 12WLPMicrocontrollers12-WLP (1.67x1.77)N/A-40°C ~ 85°C (TA)
Core Processor:
MAXQ
Core Size:
16-Bit
Connectivity:
I2C
Peripherals:
PWM, WDT
Number of I/O:
4
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 2x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
12-WLP (1.67×1.77)
Package / Case:
12-XFBGA, WLBGA
998
MAX301CPEMAX301CPEAnalog Devices Inc.IC SWITCH SPST-NOX2 35OHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
1,080
MAX301CPE+MAX301CPE+Analog Devices Inc.IC SWITCH SPST-NOX2 35OHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
1,986
MAX301CSEMAX301CSEAnalog Devices Inc.IC SWITCH SPST-NOX2 35OHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
134
MAX301CSE+MAX301CSE+Analog Devices Inc.IC SWITCH SPST-NOX2 35OHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
927
MAX301CSE+TMAX301CSE+TAnalog Devices Inc.IC SWITCH SPST-NOX2 35OHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
676
MAX301EPEMAX301EPEAnalog Devices Inc.IC SWITCH SPST-NOX2 35OHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
910
MAX301ESEMAX301ESEAnalog Devices Inc.IC SWITCH SPST-NOX2 35OHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
958
N/AMAX301ESE/GG8Analog Devices Inc.INTEGRATED CIRCUITAnalog Switches, Multiplexers, DemultiplexersN/AN/AN/A

N/A

1,065
MAX301ESE+MAX301ESE+Analog Devices Inc.IC SWITCH SPST-NOX2 35OHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NO
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±4.5V ~ 20V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
10pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
500pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
1,221

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