Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMAX32666GXMBT+TAnalog Devices Inc.IC MCU 32BIT 1MB FLASH 121CTBGAMicrocontrollers121-CTBGA (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M4F
Core Size:
32-Bit Dual-Core
Speed:
96MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
Bluetooth, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
192K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 8x10b Sigma-Delta
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
121-CTBGA (8×8)
Package / Case:
121-LFBGA
106
MAX32670GTL+MAX32670GTL+Analog Devices Inc.IC MCU 32BIT 384KB FLASH 40TQFNMicrocontrollers40-TQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
4-Wire, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-TQFN (5×5)
Package / Case:
40-WFQFN Exposed Pad
1,347
N/AMAX32670GTL+TAnalog Devices Inc.M4 CORE 100MHZ, 384KB/160KB (W/Microcontrollers40-TQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
4-Wire, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
31
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-TQFN (5×5)
Package / Case:
40-WFQFN Exposed Pad
652
MAX32672GTL+MAX32672GTL+Analog Devices Inc.IC MCU 32BIT 1MB FLASH 40TQFNMicrocontrollers40-TQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
4-Wire, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-TQFN (5×5)
Package / Case:
40-WFQFN Exposed Pad
1,501
N/AMAX32672GTL+TAnalog Devices Inc.M4 CORE 96MHZ, 1024KB (W/ ECC),Microcontrollers40-TQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
FIFO, I2C, SPI, UART/USART
Peripherals:
AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-TQFN (5×5)
Package / Case:
40-WFQFN Exposed Pad
17
MAX32672GTLBL+MAX32672GTLBL+Analog Devices Inc.M4 CORE 96MHZ, 1024KB (W/ ECC),Microcontrollers40-TQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
FIFO, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-TQFN (5×5)
Package / Case:
40-WFQFN Exposed Pad
536
N/AMAX32672GTLBL+TAnalog Devices Inc.M4 CORE 96MHZ, 1024KB (W/ ECC),Microcontrollers40-TQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
FIFO, I2C, SPI, UART/USART
Peripherals:
AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
40-TQFN (5×5)
Package / Case:
40-WFQFN Exposed Pad
72
N/AMAX32672GTNBL+Analog Devices Inc.M4 CORE 96MHZ, 1024KB (W/ ECC),Microcontrollers56-TQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
FIFO, I2C, SPI, UART/USART
Peripherals:
AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-TQFN (7×7)
Package / Case:
56-WFQFN Exposed Pad
986
N/AMAX32672GTNBL+TAnalog Devices Inc.M4 CORE 96MHZ, 1024KB (W/ ECC),Microcontrollers56-TQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
FIFO, I2C, SPI, UART/USART
Peripherals:
AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Number of I/O:
28
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
56-TQFN (7×7)
Package / Case:
56-WFQFN Exposed Pad
660
MAX32675ATK+MAX32675ATK+Analog Devices Inc.IC MCU 32BIT 384KB FLASH 68TQFNMicrocontrollers68-TQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
4-Wire, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 24x16b, 24x24b Sigma-Delta; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-TQFN (8×8)
Package / Case:
68-WFQFN Exposed Pad
449
N/AMAX32675ATK+TAnalog Devices Inc.M4 CORE 100MHZ, 384KB/160KB (W/Microcontrollers68-TQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
4-Wire, I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
RAM Size:
160K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.63V
Data Converters:
A/D 24×16/24b Sigma-Delta; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-TQFN (8×8)
Package / Case:
68-WFQFN Exposed Pad
1,996
MAX32690GTK+MAX32690GTK+Analog Devices Inc.M4 120MHZ, RISC-V CO PROCESSOR,Microcontrollers68-TQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.17V ~ 3.6V
Data Converters:
A/D 3x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-TQFN (8×8)
Package / Case:
68-WFQFN Exposed Pad
678
N/AMAX32690GTK+TAnalog Devices Inc.M4 120MHZ, RISC-V CO PROCESSOR,Microcontrollers68-TQFN (8x8)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
38
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.17V ~ 3.6V
Data Converters:
A/D 3x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
68-TQFN (8×8)
Package / Case:
68-WFQFN Exposed Pad
573
N/AMAX32690GWE+TAnalog Devices Inc.M4 120MHZ, RISC-V CO PROCESSOR,Microcontrollers140-WLP (4.53x4.49)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
120MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, Crypto – AES, POR, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
104
Program Memory Size:
3MB (3M x 8)
Program Memory Type:
FLASH
RAM Size:
1M x 8
Voltage – Supply (Vcc/Vdd):
1.17V ~ 3.6V
Data Converters:
A/D 8x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
140-WLP (4.53×4.49)
Package / Case:
140-WFBGA, WLBGA
1,563
N/AMAX326C/DAnalog Devices Inc.IC SWITCH SPST-NCX4 3.5KOHM DIEAnalog Switches, Multiplexers, DemultiplexersDieN/A0°C ~ 70°C
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
3.5kOhm
Channel-to-Channel Matching (ΔRon):
175Ohm (Typ)
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±5V ~ 18V
Switch Time (Ton, Toff) (Max):
1µs, 500ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
1.7pF, 1.7pF
Current – Leakage (IS(off)) (Max):
10pA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
Die
Supplier Device Package:
Die
1,473
MAX326CEE+MAX326CEE+Analog Devices Inc.IC SW SPST-NCX4 3.5KOHM 16QSOPAnalog Switches, Multiplexers, Demultiplexers16-QSOPN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
3.5kOhm
Channel-to-Channel Matching (ΔRon):
175Ohm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±5V ~ 18V
Switch Time (Ton, Toff) (Max):
1µs, 500ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
1.7pF, 1.7pF
Current – Leakage (IS(off)) (Max):
10pA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SSOP (0.154″”, 3.90mm Width)
Supplier Device Package:
16-QSOP
1,529
MAX326CEE+TMAX326CEE+TAnalog Devices Inc.IC SW SPST-NCX4 3.5KOHM 16QSOPAnalog Switches, Multiplexers, Demultiplexers16-QSOPN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
3.5kOhm
Channel-to-Channel Matching (ΔRon):
175Ohm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±5V ~ 18V
Switch Time (Ton, Toff) (Max):
1µs, 500ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
1.7pF, 1.7pF
Current – Leakage (IS(off)) (Max):
10pA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SSOP (0.154″”, 3.90mm Width)
Supplier Device Package:
16-QSOP
1,100
MAX326CPEMAX326CPEAnalog Devices Inc.IC SW SPST-NCX4 3.5KOHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
3.5kOhm
Channel-to-Channel Matching (ΔRon):
175Ohm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±5V ~ 18V
Switch Time (Ton, Toff) (Max):
1µs, 500ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
1.7pF, 1.7pF
Current – Leakage (IS(off)) (Max):
10pA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
1,047
MAX326CPE+MAX326CPE+Analog Devices Inc.IC SW SPST-NCX4 3.5KOHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
3.5kOhm
Channel-to-Channel Matching (ΔRon):
175Ohm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±5V ~ 18V
Switch Time (Ton, Toff) (Max):
1µs, 500ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
1.7pF, 1.7pF
Current – Leakage (IS(off)) (Max):
10pA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
537
MAX326CSEMAX326CSEAnalog Devices Inc.IC SW SPST-NCX4 3.5KOHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
4
On-State Resistance (Max):
3.5kOhm
Channel-to-Channel Matching (ΔRon):
175Ohm
Voltage – Supply, Single (V+):
10V ~ 30V
Voltage – Supply, Dual (V±):
±5V ~ 18V
Switch Time (Ton, Toff) (Max):
1µs, 500ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
1.7pF, 1.7pF
Current – Leakage (IS(off)) (Max):
10pA
Crosstalk:
-90dB @ 100kHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
184

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