Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MAX385CSEMAX385CSEAnalog Devices Inc.IC SWITCH DPST-NOX2 35OHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
DPST – NO
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
3V ~ 15V
Voltage – Supply, Dual (V±):
±3V ~ 8V
Switch Time (Ton, Toff) (Max):
175ns, 100ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
200pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
918
MAX385CSE+MAX385CSE+Analog Devices Inc.IC SWITCH DPST-NOX2 35OHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
DPST – NO
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
3V ~ 15V
Voltage – Supply, Dual (V±):
±3V ~ 8V
Switch Time (Ton, Toff) (Max):
175ns, 100ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
200pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
176
MAX385EPE+MAX385EPE+Analog Devices Inc.IC SWITCH DPST-NOX2 35OHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A-40°C ~ 85°C (TA)
Switch Circuit:
DPST – NO
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
3V ~ 15V
Voltage – Supply, Dual (V±):
±3V ~ 8V
Switch Time (Ton, Toff) (Max):
175ns, 100ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
200pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
274
MAX385ESE+MAX385ESE+Analog Devices Inc.IC SWITCH DUAL DPST 16SOICAnalog Switches, Multiplexers, DemultiplexersN/AN/AN/A

N/A

797
MAX385ESE+TMAX385ESE+TAnalog Devices Inc.IC SWITCH DPST-NOX2 35OHM 16SOICAnalog Switches, Multiplexers, Demultiplexers16-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
DPST – NO
Multiplexer/Demultiplexer Circuit:
2:1
Number of Circuits:
2
On-State Resistance (Max):
35Ohm
Channel-to-Channel Matching (ΔRon):
500mOhm
Voltage – Supply, Single (V+):
3V ~ 15V
Voltage – Supply, Dual (V±):
±3V ~ 8V
Switch Time (Ton, Toff) (Max):
175ns, 100ns
Charge Injection:
2pC
Channel Capacitance (CS(off), CD(off)):
12pF, 12pF
Current – Leakage (IS(off)) (Max):
200pA
Crosstalk:
-90dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
16-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
16-SOIC
979
MAX388CPNMAX388CPNAnalog Devices Inc.IC MUX 8:1 3KOHM 18DIPAnalog Switches, Multiplexers, Demultiplexers18-PDIPN/A0°C ~ 70°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
18-DIP (0.300″”, 7.62mm)
Supplier Device Package:
18-PDIP
500
MAX388CPN+MAX388CPN+Analog Devices Inc.IC MUX 8:1 3KOHM 18DIPAnalog Switches, Multiplexers, Demultiplexers18-PDIPN/A0°C ~ 70°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
18-DIP (0.300″”, 7.62mm)
Supplier Device Package:
18-PDIP
1,484
MAX388CWGMAX388CWGAnalog Devices Inc.IC MUX 8:1 3KOHM 24SOICAnalog Switches, Multiplexers, Demultiplexers24-SOICN/A0°C ~ 70°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
24-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
24-SOIC
1,244
MAX388CWG+MAX388CWG+Analog Devices Inc.IC MUX 8:1 3KOHM 24SOICAnalog Switches, Multiplexers, Demultiplexers24-SOICN/A0°C ~ 70°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
24-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
24-SOIC
221
MAX388CWG+TMAX388CWG+TAnalog Devices Inc.IC MUX 8:1 3KOHM 24SOICAnalog Switches, Multiplexers, Demultiplexers24-SOICN/A0°C ~ 70°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
24-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
24-SOIC
621
MAX388EPNMAX388EPNAnalog Devices Inc.IC MUX 8:1 3KOHM 18DIPAnalog Switches, Multiplexers, Demultiplexers18-PDIPN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
18-DIP (0.300″”, 7.62mm)
Supplier Device Package:
18-PDIP
504
MAX388EPN+MAX388EPN+Analog Devices Inc.IC MUX 8:1 3KOHM 18DIPAnalog Switches, Multiplexers, Demultiplexers18-PDIPN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
18-DIP (0.300″”, 7.62mm)
Supplier Device Package:
18-PDIP
485
MAX388EWG+MAX388EWG+Analog Devices Inc.IC MUX 8:1 3KOHM 24SOICAnalog Switches, Multiplexers, Demultiplexers24-SOICN/A-40°C ~ 85°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
24-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
24-SOIC
883
MAX389CPNMAX389CPNAnalog Devices Inc.IC SWITCH SP4T X 2 3KOHM 18DIPAnalog Switches, Multiplexers, Demultiplexers18-PDIPN/A0°C ~ 70°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
18-DIP (0.300″”, 7.62mm)
Supplier Device Package:
18-PDIP
115
MAX389CPN+MAX389CPN+Analog Devices Inc.IC SWITCH SP4T X 2 3KOHM 18DIPAnalog Switches, Multiplexers, Demultiplexers18-PDIPN/A0°C ~ 70°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
18-DIP (0.300″”, 7.62mm)
Supplier Device Package:
18-PDIP
1,166
MAX389CWGMAX389CWGAnalog Devices Inc.IC SWITCH SP4T X 2 3KOHM 24SOICAnalog Switches, Multiplexers, Demultiplexers24-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
24-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
24-SOIC
1,057
MAX389CWG+MAX389CWG+Analog Devices Inc.IC SWITCH SP4T X 2 3KOHM 24SOICAnalog Switches, Multiplexers, Demultiplexers24-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
24-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
24-SOIC
1,217
MAX389CWG+TMAX389CWG+TAnalog Devices Inc.IC SWITCH SP4T X 2 3KOHM 24SOICAnalog Switches, Multiplexers, Demultiplexers24-SOICN/A0°C ~ 70°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
24-SOIC (0.295″”, 7.50mm Width)
Supplier Device Package:
24-SOIC
1,268
MAX389EPNMAX389EPNAnalog Devices Inc.IC SWITCH SP4T X 2 3KOHM 18DIPAnalog Switches, Multiplexers, Demultiplexers18-PDIPN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
18-DIP (0.300″”, 7.62mm)
Supplier Device Package:
18-PDIP
1,010
MAX389EPN+MAX389EPN+Analog Devices Inc.IC SWITCH SP4T X 2 3KOHM 18DIPAnalog Switches, Multiplexers, Demultiplexers18-PDIPN/A-40°C ~ 85°C (TA)
Switch Circuit:
SP4T
Multiplexer/Demultiplexer Circuit:
4:1
Number of Circuits:
2
On-State Resistance (Max):
3kOhm
Channel-to-Channel Matching (ΔRon):
300Ohm
Voltage – Supply, Dual (V±):
±4.5V ~ 18V
Switch Time (Ton, Toff) (Max):
1.5µs, 1µs
Charge Injection:
55pC
Channel Capacitance (CS(off), CD(off)):
5pF, 25pF
Current – Leakage (IS(off)) (Max):
500pA
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
18-DIP (0.300″”, 7.62mm)
Supplier Device Package:
18-PDIP
673

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