Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MB89635PF-GT-XXXX-BNDMB89635PF-GT-XXXX-BNDInfineon TechnologiesIC MCU 8BIT 16KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
Mask ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
794
MB89635PF-GT-XXXX-BNDE1MB89635PF-GT-XXXX-BNDE1Infineon TechnologiesIC MCU 8BIT 16KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
Mask ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
173
MB89635RPF-G-1012-BNDN/AMB89635RPF-G-1012-BNDInfineon TechnologiesIC MCU 8BIT 16KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
Mask ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
210
MB89635RPF-G-1116-BNDE1N/AMB89635RPF-G-1116-BNDE1Infineon TechnologiesIC MCU 8BIT 16KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
Mask ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,022
MB89635RPF-G-1416-BNDN/AMB89635RPF-G-1416-BNDInfineon TechnologiesIC MCU 8BIT 16KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
Mask ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,112
MB89635RPF-G-1424-BNDE1N/AMB89635RPF-G-1424-BNDE1Infineon TechnologiesIC MCU 8BIT 16KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
Mask ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
919
MB89635RPMC-G-1435N/AMB89635RPMC-G-1435Infineon TechnologiesIC MCU 8BIT 16KB MROM 64QFPMicrocontrollers64-QFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
Mask ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (12×12)
Package / Case:
64-LQFP
649
MB89635RPMC-G-306-BNDE1N/AMB89635RPMC-G-306-BNDE1Infineon TechnologiesIC MCU 8BIT 16KB MROM 64QFPMicrocontrollers64-QFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
Mask ROM
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (12×12)
Package / Case:
64-LQFP
939
MB89636RP-G-1236-SHN/AMB89636RP-G-1236-SHInfineon TechnologiesIC MCU 8BIT 24KB MROM 64-SH-DIPMicrocontrollers64-SH-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
Mask ROM
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SH-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
1,629
MB89636RPF-G-1068-BNDN/AMB89636RPF-G-1068-BNDInfineon TechnologiesIC MCU 8BIT 24KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
Mask ROM
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,512
MB89636RPF-G-1437-BNDE1N/AMB89636RPF-G-1437-BNDE1Infineon TechnologiesIC MCU 8BIT 24KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
Mask ROM
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,204
MB89636RPF-G-1497E1MB89636RPF-G-1497E1Infineon TechnologiesIC MCU 8BIT 24KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
Mask ROM
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
825
MB89636RPF-G-604-BNDN/AMB89636RPF-G-604-BNDInfineon TechnologiesIC MCU 8BIT 24KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
Mask ROM
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
991
MB89636RPF-G-XXXXE1MB89636RPF-G-XXXXE1Infineon TechnologiesIC MCU 8BIT 24KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
Mask ROM
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
222
MB89636RPFR-G-1289-BNDN/AMB89636RPFR-G-1289-BNDInfineon TechnologiesIC MCU 8BIT 24KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
24KB (24K x 8)
Program Memory Type:
Mask ROM
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
339
MB89637P-GT-1014-SHN/AMB89637P-GT-1014-SHInfineon TechnologiesIC MCU 8BIT 32KB MROM 64-SH-DIPMicrocontrollers64-SH-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
Mask ROM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SH-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
402
N/AMB89637P-GT-XXX-SHInfineon TechnologiesIC MCU 8BIT 32KB MROM 64-SH-DIPMicrocontrollers64-SH-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
Mask ROM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SH-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
1,406
MB89637PF-GT-1005-BNDN/AMB89637PF-GT-1005-BNDInfineon TechnologiesIC MCU 8BIT 32KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
Mask ROM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,610
MB89637PF-GT-1083-BNDN/AMB89637PF-GT-1083-BNDInfineon TechnologiesIC MCU 8BIT 32KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
Mask ROM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
551
MB89637PF-GT-1406-BNDN/AMB89637PF-GT-1406-BNDInfineon TechnologiesIC MCU 8BIT 32KB MROM 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
Mask ROM
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,570

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