Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AN/AMB89F202RAP-G-SH-SNE1Infineon TechnologiesIC MCU 8BIT 16KB FLASH 32-SH-DIPMicrocontrollers32-SDIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
32-SDIP
Package / Case:
32-SDIP (0.400″”, 10.16mm)
1,151
MB89F538-101PF-GE1N/AMB89F538-101PF-GE1Infineon TechnologiesIC MCU 8BIT 48KB FLASH 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
I2C, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
637
MB89F538-101PMC-GSE1N/AMB89F538-101PMC-GSE1Infineon TechnologiesIC MCU 8BIT 48KB FLASH 64LQFPMicrocontrollers64-LQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
I2C, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (12×12)
Package / Case:
64-LQFP
598
N/AMB89P195-101PF-GE1Infineon TechnologiesIC MCU 8BIT 16KB OTP 28SOPMicrocontrollers28-SOPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
4.2MHz
Connectivity:
Serial I/O
Peripherals:
POR, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOP
Package / Case:
28-SOIC (0.342″”, 8.69mm Width)
292
MB89P475-101PMC-GSE1MB89P475-101PMC-GSE1Infineon TechnologiesIC MCU 8BIT 16KB OTP 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,307
MB89P475-102P-G-SH-JNE1MB89P475-102P-G-SH-JNE1Infineon TechnologiesIC MCU 8BIT 16KB OTP 48DIPMicrocontrollers48-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
29
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
3.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
48-DIP
Package / Case:
48-DIP (0.600″”, 15.24mm)
897
MB89P538-101PF-G-XXXXMB89P538-101PF-G-XXXXInfineon TechnologiesIC MCU 8BIT 48KB OTP 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
I2C, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
491
MB89P538-101PMC-GE1MB89P538-101PMC-GE1Infineon TechnologiesIC MCU 8BIT 48KB OTP 64LQFPMicrocontrollers64-LQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
I2C, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (12×12)
Package / Case:
64-LQFP
895
MB89P538-201PFR-GE1MB89P538-201PFR-GE1Infineon TechnologiesIC MCU 8BIT 48KB OTP 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
I2C, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
434
MB89P568-101PFV-GE1N/AMB89P568-101PFV-GE1Infineon TechnologiesIC MCU 8BIT 48KB OTP 80LQFPMicrocontrollers80-LQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
12.5MHz
Connectivity:
I2C, Serial I/O, UART/USART
Peripherals:
LCD, POR, PWM, WDT
Number of I/O:
50
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-LQFP (12×12)
Package / Case:
80-LQFP
506
MB89P625PF-G-LE1N/AMB89P625PF-G-LE1Infineon TechnologiesIC MCU 8BIT 16KB OTP 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 6V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,237
MB89P637-201P-GT-XXXXSHMB89P637-201P-GT-XXXXSHInfineon TechnologiesIC MCU 8BIT 32KB OTP 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,267
MB89P637-201PF-GT-XXXXMB89P637-201PF-GT-XXXXInfineon TechnologiesIC MCU 8BIT 32KB OTP 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
52
MB89P637-201PF-GTE1N/AMB89P637-201PF-GTE1Infineon TechnologiesIC MCU 8BIT 32KB OTP 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
480
MB89P637-301PF-GN/AMB89P637-301PF-GInfineon TechnologiesIC MCU 8BIT 32KB OTP 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
1,148
MB89P637P-G-SHN/AMB89P637P-G-SHInfineon TechnologiesIC MCU 8BIT 32KB OTP 64-SH-DIPMicrocontrollers64-SH-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SH-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
1,753
MB89P637P-G-SHE1N/AMB89P637P-G-SHE1Infineon TechnologiesIC MCU 8BIT 32KB OTP 64-SH-DIPMicrocontrollers64-SH-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SH-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
1,298
MB89P637P-GT-5035SHN/AMB89P637P-GT-5035SHInfineon TechnologiesIC MCU 8BIT 32KB OTP 64-SH-DIPMicrocontrollers64-SH-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SH-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
739
N/AN/AMB89P637P-GT-XXXXSHInfineon TechnologiesIC MCU 8BIT 32KB OTP 64-SH-DIPMicrocontrollers64-SH-DIPN/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SH-DIP
Package / Case:
64-DIP (0.750″”, 19.05mm)
1,034
MB89P637PF-G-5018N/AMB89P637PF-G-5018Infineon TechnologiesIC MCU 8BIT 32KB OTP 64QFPMicrocontrollers64-QFP (14x20)N/A-40°C ~ 85°C (TA)
Core Processor:
F²MC-8L
Core Size:
8-Bit
Speed:
10MHz
Connectivity:
EBI/EMI, Serial I/O, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 6V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×20)
Package / Case:
64-BQFP
702

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