 | | MB9BF568NBGL-GE1 | Infineon Technologies | IC MCU 32BIT 1.03125MB 112FBGA | Microcontrollers | 112-FBGA (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 112-FBGA (7×7) | 481 | |
 | | MB9BF568RPMC-G-JNE2 | Infineon Technologies | IC MCU 32BIT 1.03125MB 120LQFP | Microcontrollers | 120-LQFP (16x16) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1.03125MB (1.03125M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b; D/A 2x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 120-LQFP (16×16) | 488 | |
 | | MB9BFD18SPMC-GK7E1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 65 | |
 | | MB9BFD18TPMC-GK7E1 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, UART/USART, USB Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 49 | |
 | | MB9DF125EPMC-GSK5E2 | Infineon Technologies | IC MCU 32BIT 1MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,243 | |
 | | MB9DF126BPMC-GSK5E2 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 721 | |
 | | MB9DF126PMC-GSK5E2 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,882 | |
| N/A | N/A | MB9DF566MABEQ-GTK5E1 | Infineon Technologies | IC MCU 32B 2.25MB FLASH 208TEQFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 2.25MB (2.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 40x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 827 | |
| N/A | N/A | MB9DF566MADEQ-GTK5E1 | Infineon Technologies | IC MCU 32B 2.25MB FLASH 208TEQFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 2.25MB (2.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 40x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 801 | |
| N/A | | MB9DF566MAEEQ-GTK5E1 | Infineon Technologies | IC MCU 32B 2.25MB FLASH 208TEQFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 2.25MB (2.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 40x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 979 | |
| N/A | N/A | MB9DF566MGBEQ-GTK5E1 | Infineon Technologies | IC MCU 32B 2.25MB FLASH 208TEQFP | Microcontrollers | 208-TEQFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-R5F Core Size: 32-Bit Single-Core Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Program Memory Size: 2.25MB (2.25M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 40x12b; D/A 2x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 208-TEQFP (28×28) Package / Case: 208-LQFP Exposed Pad | 704 | |
 | N/A | MB9EF226BPMC-GSE2-HTV | Infineon Technologies | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 87 | |
 | | MB9EF226PMC-GSK5E2 | Infineon Technologies | IC MCU 32BIT 2MB FLASH 176LQFP | Microcontrollers | 176-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-R4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.1V ~ 5.5V Data Converters: A/D 50x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 176-LQFP (24×24) | 1,726 | |
| N/A | N/A | MC-10047F1-JN5-A | Renesas | IC MCU 32BIT FLASH SMD | Microcontrollers | N/A | N/A | N/A | N/A | 99 | |
 | N/A | MC-10287BF1-HN4-A#YB1 | Renesas | IC MCU 32B 768KB ROMLESS 324BGA | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, SCI, UART/USART Program Memory Size: 768KB (768K x 8) Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) | 406 | |
 | N/A | MC-10287BF1-HN4-A#YK1 | Renesas | IC MCU 32B 768KB ROMLESS 324BGA | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, SCI, UART/USART Program Memory Size: 768KB (768K x 8) Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) | 166 | |
 | | MC-10287BF1-HN4-M1-A | Renesas | IC MCU 32BIT 768KB ROMLSS 324BGA | Microcontrollers | 324-BGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, SCI, UART/USART Program Memory Size: 768KB (768K x 8) Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-BGA (19×19) | 767 | |
| N/A | N/A | MC-10287F1-HN4-A#YB2 | Renesas | IC MCU 32B 768KB ROMLESS 324BGA | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, SCI, UART/USART Program Memory Size: 768KB (768K x 8) Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) | 467 | |
| N/A | N/A | MC-10287F1-HN4-A#YK3 | Renesas | IC MCU 32B 768KB ROMLESS 324BGA | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, SCI, UART/USART Program Memory Size: 768KB (768K x 8) Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) | 1,779 | |
 | | MC-10287F1-HN4-M1-A | Renesas | IC MCU 32BIT 768KB ROMLSS 324BGA | Microcontrollers | 324-BGA (19x19) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M3 Core Size: 32-Bit Single-Core Connectivity: CANbus, Ethernet, I2C, SCI, UART/USART Program Memory Size: 768KB (768K x 8) Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 0.9V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 324-BGA (19×19) | 756 | |