Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC3488ADR2GMC3488ADR2GonsemiIC DRIVER 2/0 8SOICDrivers, Receivers, Transceivers8-SOIC10.8V ~ 13.2V0°C ~ 70°C
Type:
Driver
Protocol:
RS232, RS423
Number of Drivers/Receivers:
2/0
Voltage – Supply:
10.8V ~ 13.2V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,233
MC3488AP1MC3488AP1onsemiIC DRIVER 2/0 8DIPDrivers, Receivers, Transceivers8-PDIP10.8V ~ 13.2VN/A
Type:
Driver
Protocol:
RS232, RS423
Number of Drivers/Receivers:
2/0
Voltage – Supply:
10.8V ~ 13.2V
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-PDIP
637
MC3488AP1GMC3488AP1GonsemiIC DRIVER 2/0 8DIPDrivers, Receivers, Transceivers8-PDIP10.8V ~ 13.2V0°C ~ 70°C
Type:
Driver
Protocol:
RS232, RS423
Number of Drivers/Receivers:
2/0
Voltage – Supply:
10.8V ~ 13.2V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Through Hole
Package / Case:
8-DIP (0.300″”, 7.62mm)
Supplier Device Package:
8-PDIP
1,078
MC34901SEFMC34901SEFNXP SemiconductorsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,656
MC34901SEFR2MC34901SEFR2NXP SemiconductorsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
896
MC34901WEFMC34901WEFNXP SemiconductorsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
394
MC34901WEFR2MC34901WEFR2NXP SemiconductorsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
336
MC34901WNEFR2N/AMC34901WNEFR2NXP SemiconductorsIC TRANSCEIVER 1/1 8SOICDrivers, Receivers, Transceivers8-SOIC4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
74
MC34CM0902WEFMC34CM0902WEFNXP SemiconductorsIC TRANSCEIVER 2/2 14SOICDrivers, Receivers, Transceivers14-SOIC4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
2/2
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
562
MC34CM0902WEFR2MC34CM0902WEFR2NXP SemiconductorsIC TRANSCEIVER 2/2 14SOICDrivers, Receivers, Transceivers14-SOIC4.5V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
2/2
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
14-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
14-SOIC
152
MC34CM3120EPR2MC34CM3120EPR2NXP SemiconductorsIC TRANSCEIVER IO-LINK 48QFNDrivers, Receivers, Transceivers48-QFN-EP (7x7)8V ~ 32V-40°C ~ 85°C
Type:
Transceiver
Protocol:
IO-Link
Voltage – Supply:
8V ~ 32V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
48-VFQFN Exposed Pad
Supplier Device Package:
48-QFN-EP (7×7)
337
MC56F8002VWLMC56F8002VWLNXP SemiconductorsIC MCU 16BIT 12KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
12KB (6K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,831
MC56F8002VWLRMC56F8002VWLRNXP SemiconductorsIC MCU 16BIT 12KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
12KB (6K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
948
MC56F8006MLCMC56F8006MLCNXP SemiconductorsIC MCU 16BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 18x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,105
MC56F8006VLCMC56F8006VLCNXP SemiconductorsIC MCU 16BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
27
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 18x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
391
MC56F8006VLFMC56F8006VLFNXP SemiconductorsIC MCU 16BIT 16KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 24x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,085
MC56F8006VWLMC56F8006VWLNXP SemiconductorsIC MCU 16BIT 16KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,323
MC56F8006VWLRMC56F8006VWLRNXP SemiconductorsIC MCU 16BIT 16KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
23
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 15x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
602
MC56F8011VFAEMC56F8011VFAENXP SemiconductorsIC MCU 16BIT 12KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
12KB (6K x 16)
Program Memory Type:
FLASH
RAM Size:
1K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
192
MC56F8013MFAEMC56F8013MFAENXP SemiconductorsIC MCU 16BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
16KB (8K x 16)
Program Memory Type:
FLASH
RAM Size:
2K x 16
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
536

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