Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC908AZ32AVFUEMC908AZ32AVFUENXP SemiconductorsIC MCU 8BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
40
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
202
MC908AZ60ACFUMC908AZ60ACFUNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
232
MC908AZ60ACFUEMC908AZ60ACFUENXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,220
MC908AZ60ACFUERMC908AZ60ACFUERNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
448
MC908AZ60AMFUMC908AZ60AMFUNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,543
MC908AZ60AMFUEMC908AZ60AMFUENXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,590
MC908AZ60AMFUERMC908AZ60AMFUERNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,099
MC908AZ60AVFUMC908AZ60AVFUNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,372
MC908AZ60AVFUEMC908AZ60AVFUENXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
852
MC908AZ60AVFUERMC908AZ60AVFUERNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
93
MC908AZ60AVFUR2MC908AZ60AVFUR2NXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8.4MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
52
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 15x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,630
MC908BD48IBEMC908BD48IBENXP SemiconductorsIC MCU 8BIT 48KB FLASH 42DIPMicrocontrollers42-PDIPN/A0°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
6MHz
Connectivity:
I2C, USB
Peripherals:
POR, PWM
Number of I/O:
32
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 6x8b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
482
MC908EY16ACFJEMC908EY16ACFJENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
171
MC908EY16ACFJERMC908EY16ACFJERNXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
944
MC908EY16CFAEMC908EY16CFAENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,024
MC908EY16MFAEMC908EY16MFAENXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM
Number of I/O:
24
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,049
MC908EY8AMFJEMC908EY8AMFJENXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
185
MC908EY8MFAEMC908EY8MFAENXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
LINbus, SCI, SPI
Peripherals:
POR, PWM
Number of I/O:
24
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,940
MC908GP16CBEMC908GP16CBENXP SemiconductorsIC MCU 8BIT 16KB FLASH 42DIPMicrocontrollers42-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
31
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
1,403
MC908GP16CFBEMC908GP16CFBENXP SemiconductorsIC MCU 8BIT 16KB FLASH 44QFPMicrocontrollers44-QFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI, SPI
Peripherals:
LVD, POR, PWM
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-QFP (10×10)
Package / Case:
44-QFP
113

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