Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC908QY8CDTEMC908QY8CDTENXP SemiconductorsIC MCU 8BIT 8KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
820
MC908QY8CDWEMC908QY8CDWENXP SemiconductorsIC MCU 8BIT 8KB FLASH 16SOICMicrocontrollers16-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
131
MC908QY8CDWERMC908QY8CDWERNXP SemiconductorsIC MCU 8BIT 8KB FLASH 16SOICMicrocontrollers16-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
71
MC908QY8CPEMC908QY8CPENXP SemiconductorsIC MCU 8BIT 8KB FLASH 16DIPMicrocontrollers16-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
16-PDIP
Package / Case:
16-DIP (0.300″”, 7.62mm)
843
MC908QY8VDWEMC908QY8VDWENXP SemiconductorsIC MCU 8BIT 8KB FLASH 16SOICMicrocontrollers16-SOICN/A-40°C ~ 105°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Peripherals:
LVD, POR, PWM
Number of I/O:
13
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC
Package / Case:
16-SOIC (0.295″”, 7.50mm Width)
92
MC908SR12CBEMC908SR12CBENXP SemiconductorsIC MCU 8BIT 12KB FLASH 42DIPMicrocontrollers42-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, Temp Sensor
Number of I/O:
29
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 11x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
42-PDIP
Package / Case:
42-SDIP (0.600″”, 15.24mm)
11
MC908SR12CFAEMC908SR12CFAENXP SemiconductorsIC MCU 8BIT 12KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, Temp Sensor
Number of I/O:
31
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
43
MC908SR12MFAEMC908SR12MFAENXP SemiconductorsIC MCU 8BIT 12KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, Temp Sensor
Number of I/O:
31
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
89
MC908SR12MFAERMC908SR12MFAERNXP SemiconductorsIC MCU 8BIT 12KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HC08
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
I2C, SCI
Peripherals:
LVD, POR, PWM, Temp Sensor
Number of I/O:
31
Program Memory Size:
12KB (12K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 14x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
569
MC912D60ACFU8MC912D60ACFU8NXP SemiconductorsIC MCU 16BIT 60KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
980
MC912D60ACFUE8MC912D60ACFUE8NXP SemiconductorsIC MCU 16BIT 60KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,013
MC912D60ACPV8MC912D60ACPV8NXP SemiconductorsIC MCU 16BIT 60KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,051
MC912D60ACPVE8MC912D60ACPVE8NXP SemiconductorsIC MCU 16BIT 60KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
1,256
MC912D60AMFUE8MC912D60AMFUE8NXP SemiconductorsIC MCU 16BIT 60KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
772
MC912D60AMPVE8MC912D60AMPVE8NXP SemiconductorsIC MCU 16BIT 60KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
928
MC912D60AVFUE8MC912D60AVFUE8NXP SemiconductorsIC MCU 16BIT 60KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
48
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
588
MC912D60AVPVE8MC912D60AVPVE8NXP SemiconductorsIC MCU 16BIT 60KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
453
MC912D60CCPVEMC912D60CCPVENXP SemiconductorsIC MCU 16BIT 60KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, MI Bus, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
1K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
591
MC912DG128ACPVMC912DG128ACPVNXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
69
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
725
MC912DG128ACPVEMC912DG128ACPVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU12
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
69
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 16×8/10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
8

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