Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC9S08DZ60MLCN/AMC9S08DZ60MLCNXP SemiconductorsIC MCU 8BIT 60KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
25
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
304
MC9S08DZ60MLFN/AMC9S08DZ60MLFNXP SemiconductorsIC MCU 8BIT 60KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,166
MC9S08DZ60MLHN/AMC9S08DZ60MLHNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
417
MC9S08DZ96CLFMC9S08DZ96CLFNXP SemiconductorsIC MCU 8BIT 96KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,051
MC9S08DZ96CLHMC9S08DZ96CLHNXP SemiconductorsIC MCU 8BIT 96KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
566
MC9S08DZ96CLLMC9S08DZ96CLLNXP SemiconductorsIC MCU 8BIT 96KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
87
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,659
MC9S08DZ96MLFMC9S08DZ96MLFNXP SemiconductorsIC MCU 8BIT 96KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
39
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
693
MC9S08DZ96MLHMC9S08DZ96MLHNXP SemiconductorsIC MCU 8BIT 96KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
53
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,720
MC9S08DZ96MLLMC9S08DZ96MLLNXP SemiconductorsIC MCU 8BIT 96KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
87
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 24x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
643
MC9S08EL16CTJMC9S08EL16CTJNXP SemiconductorsIC MCU 8BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
1,164
MC9S08EL16CTLMC9S08EL16CTLNXP SemiconductorsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
241
MC9S08EL16CTLRMC9S08EL16CTLRNXP SemiconductorsIC MCU 8BIT 16KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
262
MC9S08EL32CTJMC9S08EL32CTJNXP SemiconductorsIC MCU 8BIT 32KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
236
MC9S08EL32CTLMC9S08EL32CTLNXP SemiconductorsIC MCU 8BIT 32KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, LINbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
512 x 8
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
496
MC9S08FL16CBMMC9S08FL16CBMNXP SemiconductorsIC MCU 8BIT 16KB FLASH 32SDIPMicrocontrollers32-SDIPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
SCI
Peripherals:
LVD, PWM, WDT
Number of I/O:
30
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
32-SDIP
Package / Case:
32-SDIP (0.400″”, 10.16mm)
1,801
MC9S08FL16CLCMC9S08FL16CLCNXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
SCI
Peripherals:
LVD, PWM, WDT
Number of I/O:
30
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,923
MC9S08FL8CBMMC9S08FL8CBMNXP SemiconductorsIC MCU 8BIT 8KB FLASH 32SDIPMicrocontrollers32-SDIPN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
SCI
Peripherals:
LVD, PWM, WDT
Number of I/O:
30
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
32-SDIP
Package / Case:
32-SDIP (0.400″”, 10.16mm)
784
MC9S08FL8CLCMC9S08FL8CLCNXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
SCI
Peripherals:
LVD, PWM, WDT
Number of I/O:
30
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
376
MC9S08FL8CLCRMC9S08FL8CLCRNXP SemiconductorsIC MCU 8BIT 8KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
20MHz
Connectivity:
SCI
Peripherals:
LVD, PWM, WDT
Number of I/O:
30
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
768 x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
1,204
MC9S08GB32ACFUEMC9S08GB32ACFUENXP SemiconductorsIC MCU 8BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
40MHz
Connectivity:
I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
147

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