Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC9S08JE128VLKN/AMC9S08JE128VLKNXP SemiconductorsIC MCU 8BIT 128KB FLASH 80FQFPMicrocontrollers80-FQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
46
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-FQFP (12×12)
Package / Case:
80-LQFP
1,000
MC9S08JE64CLHN/AMC9S08JE64CLHNXP SemiconductorsIC MCU 8BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
488
MC9S08JE64VLHN/AMC9S08JE64VLHNXP SemiconductorsIC MCU 8BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
665
MC9S08JM16CGTMC9S08JM16CGTNXP SemiconductorsIC MCU 8BIT 16KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,192
MC9S08JM16CLCMC9S08JM16CLCNXP SemiconductorsIC MCU 8BIT 16KB FLASH 32LQFPMicrocontrollers32-LQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 4x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-LQFP (7×7)
Package / Case:
32-LQFP
673
MC9S08JM16CLDMC9S08JM16CLDNXP SemiconductorsIC MCU 8BIT 16KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
280
MC9S08JM32CGTMC9S08JM32CGTNXP SemiconductorsIC MCU 8BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-VFQFN Exposed Pad
253
MC9S08JM32CLDMC9S08JM32CLDNXP SemiconductorsIC MCU 8BIT 32KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
500
MC9S08JM32CLHMC9S08JM32CLHNXP SemiconductorsIC MCU 8BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
140
MC9S08JM32CQHMC9S08JM32CQHNXP SemiconductorsIC MCU 8BIT 32KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
727
MC9S08JM60CGTMC9S08JM60CGTNXP SemiconductorsIC MCU 8BIT 60KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
37
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-VFQFN Exposed Pad
1,338
MC9S08JM60CLDMC9S08JM60CLDNXP SemiconductorsIC MCU 8BIT 60KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
419
MC9S08JM60CLDRMC9S08JM60CLDRNXP SemiconductorsIC MCU 8BIT 60KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
251
MC9S08JM60CLHMC9S08JM60CLHNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
564
MC9S08JM60CQHMC9S08JM60CQHNXP SemiconductorsIC MCU 8BIT 60KB FLASH 64QFPMicrocontrollers64-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
51
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-QFP
1,713
MC9S08JM8CLDMC9S08JM8CLDNXP SemiconductorsIC MCU 8BIT 8KB FLASH 44LQFPMicrocontrollers44-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
33
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
44-LQFP (10×10)
Package / Case:
44-LQFP
1,136
MC9S08JS16CFKMC9S08JS16CFKNXP SemiconductorsIC MCU 8BIT 16KB FLASH 24QFNMicrocontrollers24-QFN-EP (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM
Number of I/O:
14
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-QFN-EP (5×5)
Package / Case:
24-VQFN Exposed Pad
348
MC9S08JS16CWJMC9S08JS16CWJNXP SemiconductorsIC MCU 8BIT 16KB FLASH 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM
Number of I/O:
14
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
1,109
MC9S08JS16LCFKMC9S08JS16LCFKNXP SemiconductorsMICROCONTROLLER, 8-BIT, HC08/S08Microcontrollers24-HVQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM
Number of I/O:
14
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-HVQFN (5×5)
Package / Case:
24-VQFN Exposed Pad
439
MC9S08JS16LCWJMC9S08JS16LCWJNXP SemiconductorsIC MCU 8BIT 16KB FLASH 20SOICMicrocontrollers20-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
S08
Core Size:
8-Bit
Speed:
48MHz
Connectivity:
LINbus, SCI, SPI, USB
Peripherals:
LVD, POR, PWM
Number of I/O:
14
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
512 x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
554

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