Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC9S12KG128VPVEMC9S12KG128VPVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
530
MC9S12KG256MPVEMC9S12KG256MPVENXP SemiconductorsIC MCU 16BIT 256KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
91
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.35V ~ 5.5V
Data Converters:
A/D 16x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
287
MC9S12NE64CPVMC9S12NE64CPVNXP SemiconductorsIC MCU 16BIT 64KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.375V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
706
MC9S12NE64CPVEMC9S12NE64CPVENXP SemiconductorsIC MCU 16BIT 64KB FLASH 112LQFPMicrocontrollers112-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
70
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.375V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
112-LQFP (20×20)
Package / Case:
112-LQFP
874
MC9S12NE64VTUMC9S12NE64VTUNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80TQFPMicrocontrollers80-TQFP-EP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.375V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP-EP (14×14)
Package / Case:
80-TQFP Exposed Pad
541
MC9S12NE64VTUEMC9S12NE64VTUENXP SemiconductorsIC MCU 16BIT 64KB FLASH 80TQFPMicrocontrollers80-TQFP-EP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
EBI/EMI, Ethernet, I2C, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
38
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.375V ~ 3.465V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP-EP (14×14)
Package / Case:
80-TQFP Exposed Pad
1,017
MC9S12P128MQKMC9S12P128MQKNXP SemiconductorsIC MCU 16BIT 128KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
303
MC9S12P32CFTMC9S12P32CFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
864
MC9S12P32MFTN/AMC9S12P32MFTNXP SemiconductorsIC MCU 16BIT 32KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
1,138
MC9S12P64CFTMC9S12P64CFTNXP SemiconductorsIC MCU 16BIT 64KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
1,033
MC9S12P64CLHMC9S12P64CLHNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
384
MC9S12P64CQKMC9S12P64CQKNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
178
MC9S12P64VLHN/AMC9S12P64VLHNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
337
MC9S12P64VLHRN/AMC9S12P64VLHRNXP SemiconductorsIC MCU 16BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
49
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
423
MC9S12P64VQKN/AMC9S12P64VQKNXP SemiconductorsIC MCU 16BIT 64KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
64
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-QFP
1,256
MC9S12P96CFTMC9S12P96CFTNXP SemiconductorsIC MCU 16BIT 96KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
1,079
MC9S12P96MFTMC9S12P96MFTNXP SemiconductorsIC MCU 16BIT 96KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
1,162
MC9S12P96MFTRMC9S12P96MFTRNXP SemiconductorsIC MCU 16BIT 96KB FLASH 48QFNMicrocontrollers48-QFN-EP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
32MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
34
Program Memory Size:
96KB (96K x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
6K x 8
Voltage – Supply (Vcc/Vdd):
1.72V ~ 5.5V
Data Converters:
A/D 10x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN-EP (7×7)
Package / Case:
48-TFQFN Exposed Pad
948
MC9S12T64CPKE16MC9S12T64CPKE16NXP SemiconductorsIC MCU 16BIT 64KB FLASH 80FQFPMicrocontrollers80-FQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-FQFP (12×12)
Package / Case:
80-LQFP
121
MC9S12T64MPKE16MC9S12T64MPKE16NXP SemiconductorsIC MCU 16BIT 64KB FLASH 80FQFPMicrocontrollers80-FQFP (12x12)N/A-40°C ~ 125°C (TA)
Core Processor:
HCS12
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI
Peripherals:
LVD, POR, PWM, WDT
Number of I/O:
59
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 2.75V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-FQFP (12×12)
Package / Case:
80-LQFP
1,026

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