Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCF52210CEP66MCF52210CEP66NXP SemiconductorsIC MCU 32BIT 64KB FLASH 64QFNMicrocontrollers64-QFN-EP (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN-EP (9×9)
Package / Case:
64-VFQFN Exposed Pad
2
MCF52210CVM66MCF52210CVM66NXP SemiconductorsIC MCU 32BIT 64KB FLASH 81MAPBGAMicrocontrollers81-MAPBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
81-MAPBGA (10×10)
Package / Case:
81-LBGA
1,174
N/AMCF52210CVM80NXP SemiconductorsIC MCU 32BIT 64KB FLASH 81MAPBGAMicrocontrollers81-MAPBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
81-MAPBGA (10×10)
Package / Case:
81-LBGA
1,242
MCF52211CAE66MCF52211CAE66NXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,994
MCF52211CAE80MCF52211CAE80NXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
538
MCF52211CAF80MCF52211CAF80NXP SemiconductorsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
ColdFire V2
Core Size:
32-Bit
Speed:
80MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
63
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
44
MCF52211CEP66MCF52211CEP66NXP SemiconductorsIC MCU 32BIT 128KB FLASH 64QFNMicrocontrollers64-QFN-EP (9x9)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
43
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFN-EP (9×9)
Package / Case:
64-VFQFN Exposed Pad
1,142
MCF52211CVM66MCF52211CVM66NXP SemiconductorsIC MCU 32BIT 128KB FLSH 81MAPBGAMicrocontrollers81-MAPBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
55
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
81-MAPBGA (10×10)
Package / Case:
81-LBGA
547
MCF52212AE50MCF52212AE50NXP SemiconductorsIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,831
MCF52212CAE50MCF52212CAE50NXP SemiconductorsIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
901
MCF52213AE50MCF52213AE50NXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A0°C ~ 70°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
111
MCF52213CAE50MCF52213CAE50NXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
671
MCF52221CAE66N/AMCF52221CAE66NXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
36
MCF52221CAF66N/AMCF52221CAF66NXP SemiconductorsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
682
MCF52221CAF80N/AMCF52221CAF80NXP SemiconductorsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
401
MCF52221CVM66N/AMCF52221CVM66NXP SemiconductorsIC MCU 32BIT 128KB FLSH 81MAPBGAMicrocontrollers81-MAPBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
81-MAPBGA (10×10)
Package / Case:
81-LBGA
151
MCF52221CVM80N/AMCF52221CVM80NXP SemiconductorsIC MCU 32BIT 128KB FLSH 81MAPBGAMicrocontrollers81-MAPBGA (10x10)N/A-40°C ~ 85°C
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
81-MAPBGA (10×10)
Package / Case:
81-LBGA
1,119
MCF52223CAF66N/AMCF52223CAF66NXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
782
MCF52223CAF80N/AMCF52223CAF80NXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
80MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
1,726
MCF52223CVM66N/AMCF52223CVM66NXP SemiconductorsIC MCU 32BIT 256KB FLSH 81MAPBGAMicrocontrollers81-MAPBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
Coldfire V2
Core Size:
32-Bit Single-Core
Speed:
66MHz
Connectivity:
I2C, SPI, UART/USART, USB OTG
Peripherals:
DMA, LVD, POR, PWM, WDT
Number of I/O:
56
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
81-MAPBGA (10×10)
Package / Case:
81-LBGA
1,331

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