Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AMIMXRT1187CVM8BNXP SemiconductorsICMicroprocessors289-MAPBGA (14x14)N/A-40 °C – 105 °C
Speed:
800 MHz
Core Processor:
ARM® Cortex®-M33
Number of Cores/Bus Width:
2 Core, 32-Bit
RAM Controllers:
DDR3
Ethernet:
1Gbps (5)
USB:
USB 2.0 OTG + PHY (2)
Graphics Acceleration:
No
Qualification:
Industrial
923
N/AMIMXRT1189CVM8BNXP SemiconductorsICMicrocontrollers289-LFBGA (14x14)N/A-40°C ~ 105°C (TJ)
Core Processor:
ARM® Cortex®-M33, ARM® Cortex®-M7
Core Size:
32-Bit Dual-Core
Speed:
240MHz, 800MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals:
Crypto – AES, DMA, PWM, RSA, SHA, TRNG, WDT
Number of I/O:
173
Program Memory Type:
ROM
RAM Size:
1.5M x 8
Data Converters:
D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Mounting Type:
Surface Mount
Supplier Device Package:
289-LFBGA (14×14)
Package / Case:
289-LFBGA
1,404
N/AMIMXRT533SFAWCRNXP SemiconductorsIC MCU 32BIT 192KB ROM 141WLCSPMicrocontrollers141-WLCSP (4.53x4.53)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
ROM
RAM Size:
3M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
141-WLCSP (4.53×4.53)
Package / Case:
141-XFBGA, WLCSP
8
N/AMIMXRT533SFFOCNXP SemiconductorsIC MCU 32BIT 192KB ROM 249FOWLPMicrocontrollers249-FOWLP (7x7)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
ROM
RAM Size:
3M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
249-FOWLP (7×7)
Package / Case:
249-WFBGA
517
N/AMIMXRT533SFFOCRNXP SemiconductorsIC MCU 32BIT 192KB ROM 249FOWLPMicrocontrollers249-FOWLP (7x7)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
ROM
RAM Size:
3M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
249-FOWLP (7×7)
Package / Case:
249-WFBGA
485
N/AMIMXRT555SFAWCRNXP SemiconductorsIC MCU 32BIT 192KB ROM 141WLCSPMicrocontrollers141-WLCSP (4.53x4.53)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
ROM
RAM Size:
5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
141-WLCSP (4.53×4.53)
Package / Case:
141-XFBGA, WLCSP
1,081
N/AMIMXRT555SFFOCNXP SemiconductorsIC MCU 32BIT 192KB ROM 249FOWLPMicrocontrollers249-FOWLP (7x7)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
ROM
RAM Size:
5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
249-FOWLP (7×7)
Package / Case:
249-WFBGA
1,020
N/AMIMXRT555SFFOCRNXP SemiconductorsIC MCU 32BIT 192KB ROM 249FOWLPMicrocontrollers249-FOWLP (7x7)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
ROM
RAM Size:
5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
249-FOWLP (7×7)
Package / Case:
249-WFBGA
413
N/AMIMXRT595SFAWCRNXP SemiconductorsIC MCU 32BIT 192KB ROM 141WLCSPMicrocontrollers141-WLCSP (4.53x4.53)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
ROM
RAM Size:
5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
141-WLCSP (4.53×4.53)
Package / Case:
141-XFBGA, WLCSP
129
MIMXRT595SFFOCMIMXRT595SFFOCNXP SemiconductorsIC MCU 32BIT EXT MEM 249FOWLPMicrocontrollers249-FOWLP (7x7)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Type:
External Program Memory
RAM Size:
5M x 8
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
249-FOWLP (7×7)
Package / Case:
249-WFBGA
1,252
N/AMIMXRT595SFFOCRNXP SemiconductorsIC MCU 32BIT 192KB ROM 249FOWLPMicrocontrollers249-FOWLP (7x7)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
200MHz
Connectivity:
eMMC/SD/SDIO, I2C, LINbus, SPI, UART/USART, USB
Peripherals:
DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
136
Program Memory Size:
192KB (192K x 8)
Program Memory Type:
ROM
RAM Size:
5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 10x12b
Oscillator Type:
External, Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
249-FOWLP (7×7)
Package / Case:
249-WFBGA
1,238
MIMXRT633SFVKBMIMXRT633SFVKBNXP SemiconductorsIC MCU 32BIT EXT MEM 176VFBGAMicrocontrollers176-VFBGA (9x9)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
96
Program Memory Type:
External Program Memory
RAM Size:
3M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-VFBGA (9×9)
Package / Case:
176-VFBGA
1,558
N/AN/AMIMXRT685SFAWBRNXP SemiconductorsIC MCU 32BIT EXT MEM 114WLCSPMicrocontrollers114-WLCSP (4.24x4.24)N/A-20°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
65
Program Memory Type:
External Program Memory
RAM Size:
4.5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
114-WLCSP (4.24×4.24)
Package / Case:
114-UFBGA, WLCSP
1,039
MIMXRT685SFFOBN/AMIMXRT685SFFOBNXP SemiconductorsIC MCU 32BIT EXT MEM 249FOWLPMicrocontrollers249-FOWLP (7x7)N/A-20°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
147
Program Memory Type:
External Program Memory
RAM Size:
4.5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
249-FOWLP (7×7)
Package / Case:
249-WFBGA
1,174
N/AMIMXRT685SFFOBRNXP SemiconductorsIC MCU 32BIT EXT MEM 249FOWLPMicrocontrollers249-FOWLP (7x7)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
147
Program Memory Type:
External Program Memory
RAM Size:
4.5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
249-FOWLP (7×7)
Package / Case:
249-WFBGA
820
MIMXRT685SFVKBMIMXRT685SFVKBNXP SemiconductorsIC MCU 32BIT EXT MEM 176VFBGAMicrocontrollers176-VFBGA (9x9)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
96
Program Memory Type:
External Program Memory
RAM Size:
4.5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-VFBGA (9×9)
Package / Case:
176-VFBGA
1,068
N/AMIMXRT685SFVKBRNXP SemiconductorsIC MCU 32BIT EXT MEM 176VFBGAMicrocontrollers176-VFBGA (9x9)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
300MHz
Connectivity:
EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
96
Program Memory Type:
External Program Memory
RAM Size:
4.5M x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-VFBGA (9×9)
Package / Case:
176-VFBGA
1,188
MK02FN128VFM10N/AMK02FN128VFM10NXP SemiconductorsIC MCU 32BIT 128KB FLASH 32QFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM
Number of I/O:
26
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
511
MK02FN128VLF10N/AMK02FN128VLF10NXP SemiconductorsIC MCU 32BIT 128KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM
Number of I/O:
35
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
507
MK02FN128VLH10MK02FN128VLH10NXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, LVD, POR, PWM
Number of I/O:
46
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,909

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