 | | MK26FN2M0VMI18 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 169MAPBGA | Microcontrollers | 169-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 5x12b, 6x16b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (9×9) | 87 | |
| N/A | | MK27FN2M0AVMI15 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 169MAPBGA | Microcontrollers | 169-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (9×9) | 940 | |
 | | MK27FN2M0VMI15 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 169MAPBGA | Microcontrollers | 169-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (9×9) | 923 | |
| N/A | | MK28FN2M0ACAU15R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 210WLCSP | Microcontrollers | 210-WLCSP (6.94x6.94) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 210-WLCSP (6.94×6.94) Package / Case: 210-UFBGA, WLCSP | 916 | |
| N/A | | MK28FN2M0AVMI15 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 169MAPBGA | Microcontrollers | 169-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (9×9) | 1,865 | |
| N/A | | MK28FN2M0CAU15R | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 210WLCSP | Microcontrollers | 210-WLCSP (6.94x6.94) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 210-WLCSP (6.94×6.94) Package / Case: 210-UFBGA, WLCSP | 194 | |
 | | MK28FN2M0VMI15 | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 169MAPBGA | Microcontrollers | 169-MAPBGA (9x9) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, I2C, QSPI, SDHC, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16b SAR; D/A 2x6b, 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 169-MAPBGA (9×9) | 533 | |
 | | MK30DN512VLL10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 38x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 270 | |
 | | MK30DN512VLQ10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 46x16b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 84 | |
 | N/A | MK30DN512ZVLK10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 80FQFP | Microcontrollers | 80-FQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 31x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-FQFP (12×12) | 128 | |
 | N/A | MK30DN512ZVLL10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 38x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 172 | |
 | N/A | MK30DN512ZVLQ10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 46x16b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,106 | |
 | N/A | MK30DN512ZVLQ10R | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 46x16b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 814 | |
 | N/A | MK30DN512ZVMD10 | NXP Semiconductors | IC MCU 32B 512KB FLASH 144MAPBGA | Microcontrollers | 144-MAPBGA (13x13) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 46x16b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-MAPBGA (13×13) | 1,178 | |
 | | MK30DX128VLH7 | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 22x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,933 | |
 | | MK30DX128VLK7 | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 80FQFP | Microcontrollers | 80-FQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 31x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-FQFP (12×12) | 1,132 | |
 | | MK30DX128VLL7 | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 38x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,392 | |
 | N/A | MK30DX128VMB7 | NXP Semiconductors | IC MCU 32BIT 128KB FLSH 81MAPBGA | Microcontrollers | 81-MAPBGA (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 31x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 81-MAPBGA (10×10) | 1,043 | |
 | N/A | MK30DX128VMC7 | NXP Semiconductors | IC MCU 32B 128KB FLASH 121MAPBGA | Microcontrollers | 121-MAPBGA (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 38x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 121-MAPBGA (8×8) | 95 | |
 | | MK30DX256VLH7 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 22x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 244 | |