 | | MK51DX256ZCLL10 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 35x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,010 | |
 | | MK51DX256ZCMC10 | NXP Semiconductors | IC MCU 32B 256KB FLASH 121MAPBGA | Microcontrollers | 121-MAPBGA (8x8) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 37x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 121-MAPBGA (8×8) | 203 | |
 | | MK52DN512CLQ10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,249 | |
 | | MK52DN512CMD10 | NXP Semiconductors | IC MCU 32B 512KB FLASH 144MAPBGA | Microcontrollers | 144-MAPBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-MAPBGA (13×13) | 102 | |
 | | MK52DN512ZCLQ10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 749 | |
 | | MK52DN512ZCMD10 | NXP Semiconductors | IC MCU 32B 512KB FLASH 144MAPBGA | Microcontrollers | 144-MAPBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-MAPBGA (13×13) | 952 | |
 | | MK53DN512CLQ10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 438 | |
 | | MK53DN512CMD10 | NXP Semiconductors | IC MCU 32B 512KB FLASH 144MAPBGA | Microcontrollers | 144-MAPBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-MAPBGA (13×13) | 173 | |
 | | MK53DN512ZCLQ10 | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,546 | |
 | | MK53DN512ZCMD10 | NXP Semiconductors | IC MCU 32B 512KB FLASH 144MAPBGA | Microcontrollers | 144-MAPBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-MAPBGA (13×13) | 920 | |
 | | MK53DX256CLQ10 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 875 | |
 | | MK53DX256CMD10 | NXP Semiconductors | IC MCU 32B 256KB FLASH 144MAPBGA | Microcontrollers | 144-MAPBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-MAPBGA (13×13) | 465 | |
 | | MK53DX256ZCLQ10 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,675 | |
 | | MK53DX256ZCMD10 | NXP Semiconductors | IC MCU 32B 256KB FLASH 144MAPBGA | Microcontrollers | 144-MAPBGA (13x13) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 41x16b; D/A 2x12b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-MAPBGA (13×13) | 1,253 | |
 | | MK60DN256VLL10 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 33x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,648 | |
 | | MK60DN256VLL10R | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 33x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,672 | |
 | | MK60DN256VLQ10 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 42x16b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 887 | |
 | | MK60DN256VMC10 | NXP Semiconductors | IC MCU 32B 256KB FLASH 121MAPBGA | Microcontrollers | 121-MAPBGA (8x8) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 42x16b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 121-MAPBGA (8×8) | 965 | |
 | | MK60DN256VMD10 | NXP Semiconductors | IC MCU 32B 256KB FLASH 144MAPBGA | Microcontrollers | 144-MAPBGA (13x13) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 42x16b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-MAPBGA (13×13) | 1,428 | |
 | | MK60DN256ZVLL10 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 100LQFP | Microcontrollers | 100-LQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 33x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 409 | |