Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MKL17Z128VLH4RMKL17Z128VLH4RNXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
865
MKL17Z128VMP4MKL17Z128VMP4NXP SemiconductorsIC MCU 32BIT 128KB FLSH 64MAPBGAMicrocontrollers64-MAPBGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-MAPBGA (5×5)
Package / Case:
64-LFBGA
723
MKL17Z128VMP4RMKL17Z128VMP4RNXP SemiconductorsIC MCU 32BIT 128KB FLSH 64MAPBGAMicrocontrollers64-MAPBGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-MAPBGA (5×5)
Package / Case:
64-LFBGA
161
MKL17Z256CAL4RMKL17Z256CAL4RNXP SemiconductorsIC MCU 32BIT 256KB FLASH 36WLCSPMicrocontrollers36-WLCSP (2.82x2.67)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
26
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 7x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-WLCSP (2.82×2.67)
Package / Case:
36-UFBGA, WLCSP
557
MKL17Z256VFM4MKL17Z256VFM4NXP SemiconductorsIC MCU 32BIT 256KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-UFQFN Exposed Pad
946
N/AMKL17Z256VFM4RNXP SemiconductorsKINETIS KL17: 48MHZ CORTEX-M0+ UMicrocontrollers32-QFN-EP (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
28
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x16b SAR; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN-EP (5×5)
Package / Case:
32-VFQFN Exposed Pad
912
MKL17Z256VFT4MKL17Z256VFT4NXP SemiconductorsIC MCU 32BIT 256KB FLASH 48QFNMicrocontrollers48-QFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 18x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN (7×7)
Package / Case:
48-UFQFN Exposed Pad
1,087
MKL17Z256VFT4RMKL17Z256VFT4RNXP SemiconductorsIC MCU 32BIT 256KB FLASH 48QFNMicrocontrollers48-QFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
40
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 18x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN (7×7)
Package / Case:
48-UFQFN Exposed Pad
128
MKL17Z256VLH4MKL17Z256VLH4NXP SemiconductorsIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
746
MKL17Z256VLH4RMKL17Z256VLH4RNXP SemiconductorsIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
683
MKL17Z256VMP4MKL17Z256VMP4NXP SemiconductorsIC MCU 32BIT 256KB FLSH 64MAPBGAMicrocontrollers64-MAPBGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-MAPBGA (5×5)
Package / Case:
64-LFBGA
577
MKL17Z256VMP4RMKL17Z256VMP4RNXP SemiconductorsIC MCU 32BIT 256KB FLSH 64MAPBGAMicrocontrollers64-MAPBGA (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, LINbus, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-MAPBGA (5×5)
Package / Case:
64-LFBGA
352
MKL17Z32VDA4MKL17Z32VDA4NXP SemiconductorsIC MCU 32BIT 32KB FLASH 36XFBGAMicrocontrollers36-XFBGA (3.5x3.5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 15x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-XFBGA (3.5×3.5)
Package / Case:
36-XFBGA
1,422
MKL17Z32VDA4RMKL17Z32VDA4RNXP SemiconductorsIC MCU 32BIT 32KB FLASH 36XFBGAMicrocontrollers36-XFBGA (3.5x3.5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
32
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 15x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-XFBGA (3.5×3.5)
Package / Case:
36-XFBGA
604
MKL17Z32VFM4MKL17Z32VFM4NXP SemiconductorsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-UFQFN Exposed Pad
426
N/AMKL17Z32VFM4RNXP SemiconductorsIC MCU 32BIT 32KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
28
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-UFQFN Exposed Pad
425
MKL17Z32VLH4MKL17Z32VLH4NXP SemiconductorsIC MCU 32BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
54
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 20x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
921
MKL17Z64VDA4MKL17Z64VDA4NXP SemiconductorsIC MCU 32BIT 64KB FLASH 36XFBGAMicrocontrollers36-XFBGA (3.5x3.5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
32
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 15x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-XFBGA (3.5×3.5)
Package / Case:
36-XFBGA
160
MKL17Z64VDA4RMKL17Z64VDA4RNXP SemiconductorsIC MCU 32BIT 64KB FLASH 36XFBGAMicrocontrollers36-XFBGA (3.5x3.5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
32
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 15x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
36-XFBGA (3.5×3.5)
Package / Case:
36-XFBGA
755
MKL17Z64VFM4MKL17Z64VFM4NXP SemiconductorsIC MCU 32BIT 64KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
I2C, FlexIO, SPI, UART/USART
Peripherals:
DMA, I2S, PWM, WDT
Number of I/O:
28
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
16K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 11x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-UFQFN Exposed Pad
588

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