 | | MKL26Z64VFT4 | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 16bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,389 | |
 | | MKL26Z64VFT4R | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 16bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 53 | |
 | | MKL26Z64VLH4 | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D – 16bit; D/A – 12bit Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 549 | |
 | | MKL27Z128VFM4 | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 32QFN | Microcontrollers | 32-HUQFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HUQFN (5×5) Package / Case: 32-UFQFN Exposed Pad | 668 | |
 | | MKL27Z128VFM4R | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 32QFN | Microcontrollers | 32-HUQFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HUQFN (5×5) Package / Case: 32-UFQFN Exposed Pad | 1,518 | |
 | | MKL27Z128VFT4 | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,047 | |
 | | MKL27Z128VLH4 | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 973 | |
 | | MKL27Z128VLH4R | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 944 | |
 | | MKL27Z128VMP4 | NXP Semiconductors | IC MCU 32BIT 128KB FLSH 64MAPBGA | Microcontrollers | 64-MAPBGA (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-MAPBGA (5×5) | 716 | |
 | | MKL27Z256VFM4 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 32QFN | Microcontrollers | 32-QFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-QFN (5×5) Package / Case: 32-UFQFN Exposed Pad | 835 | |
| N/A | | MKL27Z256VFM4R | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 32QFN | Microcontrollers | 32-QFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-QFN (5×5) Package / Case: 32-UFQFN Exposed Pad | 141 | |
 | | MKL27Z256VFT4 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 48QFN | Microcontrollers | 48-QFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-QFN (7×7) Package / Case: 48-UFQFN Exposed Pad | 221 | |
 | | MKL27Z256VLH4 | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 753 | |
 | | MKL27Z256VMP4 | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 64MAPBGA | Microcontrollers | 64-MAPBGA (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 16x16b; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-MAPBGA (5×5) | 1,201 | |
 | | MKL27Z32VDA4 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 36XFBGA | Microcontrollers | 36-XFBGA (3.5x3.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 14x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 36-XFBGA (3.5×3.5) | 1,448 | |
 | | MKL27Z32VFM4 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 32QFN | Microcontrollers | 32-QFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 8x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-QFN (5×5) Package / Case: 32-UFQFN Exposed Pad | 724 | |
 | | MKL27Z32VLH4 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 17x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,705 | |
 | | MKL27Z64VDA4 | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 36XFBGA | Microcontrollers | 36-XFBGA (3.5x3.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 14x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 36-XFBGA (3.5×3.5) | 471 | |
 | | MKL27Z64VDA4R | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 36XFBGA | Microcontrollers | 36-XFBGA (3.5x3.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 14x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 36-XFBGA (3.5×3.5) | 159 | |
 | | MKL27Z64VFM4 | NXP Semiconductors | IC MCU 32BIT 64KB FLASH 32QFN | Microcontrollers | 32-QFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: I2C, FlexIO, SPI, UART/USART, USB Peripherals: DMA, I2S, PWM, WDT Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 8x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-QFN (5×5) Package / Case: 32-UFQFN Exposed Pad | 1,332 | |