 | | MPC8358CVRAGDDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 693 | |
 | | MPC8358CVRAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 1,226 | |
| N/A | | MPC8358CVVAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 740TBGA | Microprocessors | 740-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 740-TBGA (37.5×37.5) | 950 | |
 | | MPC8358ECVRAGDDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 731 | |
 | | MPC8358ECVRAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 1,052 | |
 | | MPC8358ECVVAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 740TBGA | Microprocessors | 740-TBGA (37.5x37.5) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Supplier Device Package: 740-TBGA (37.5×37.5) | 384 | |
 | | MPC8358ECZQAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | -40°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 53 | |
 | | MPC8358EVRADDDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 308 | |
 | | MPC8358EVRAGDDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 631 | |
 | | MPC8358EVRAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 99 | |
 | | MPC8358EVVAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 740TBGA | Microprocessors | 740-TBGA (37.5x37.5) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,296 | |
 | | MPC8358EZQADDDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 370 | |
 | | MPC8358EZQAGDDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 257 | |
 | | MPC8358EZQAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 129 | |
| N/A | | MPC8358VRADDDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 459 | |
 | | MPC8358VRAGDDA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 322 | |
 | | MPC8358VRAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29×29) | 1,097 | |
 | | MPC8358VVADDEA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 740TBGA | Microprocessors | 740-TBGA (37.5x37.5) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 30 | |
 | | MPC8358VVAGDGA | NXP Semiconductors | IC MPU MPC83XX 400MHZ 740TBGA | Microprocessors | 740-TBGA (37.5x37.5) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Ethernet: 10/100/1000Mbps (1) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 740-TBGA (37.5×37.5) | 756 | |
 | | MPC8358ZQADDDA | NXP Semiconductors | IC MPU MPC83XX 266MHZ 668BGA | Microprocessors | 668-PBGA-PGE (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 379 | |