Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8541ECVTALFMPC8541ECVTALFNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
155
MPC8541EVTAJDMPC8541EVTAJDNXP SemiconductorsIC MPU MPC85XX 533MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
752
MPC8541EVTALFMPC8541EVTALFNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
342
MPC8541EVTAPFMPC8541EVTAPFNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,323
MPC8541EVTAQFMPC8541EVTAQFNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
174
MPC8541PXALFMPC8541PXALFNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
538
MPC8541PXAPFMPC8541PXAPFNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,363
MPC8541VTAJDMPC8541VTAJDNXP SemiconductorsIC MPU MPC85XX 533MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,560
MPC8541VTALFMPC8541VTALFNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
1,484
MPC8541VTAPFMPC8541VTAPFNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
314
MPC8543ECVJAQGDMPC8543ECVJAQGDNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
377
MPC8543VJANGDMPC8543VJANGDNXP SemiconductorsIC MPU MPC85XX 800MHZ 783BGAMicroprocessors783-PBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, Cryptography, Kasumi, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA
Supplier Device Package:
783-PBGA (29×29)
957
MPC8543VTANGDMPC8543VTANGDNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
615
N/AMPC8544CVJALFANXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
848
MPC8544CVJANGAMPC8544CVJANGANXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
737
MPC8544CVJAQGAMPC8544CVJAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
41
MPC8544CVTALFMPC8544CVTALFNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
694
MPC8544CVTALFAMPC8544CVTALFANXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Signal Processing; SPE
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
291
MPC8544CVTANGMPC8544CVTANGNXP SemiconductorsIC MPU MPC85XX 800MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
668
MPC8544CVTAQGAMPC8544CVTAQGANXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,029

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