Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MSP430F1222IRHBRMSP430F1222IRHBRTexas InstrumentsIC MCU 16BIT 4KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
4KB (4K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,270
MSP430F1222IRHBTMSP430F1222IRHBTTexas InstrumentsIC MCU 16BIT 4KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
4KB (4K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
402
MSP430F122IDWMSP430F122IDWTexas InstrumentsIC MCU 16BIT 4KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
4KB (4K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
519
MSP430F122IDWRMSP430F122IDWRTexas InstrumentsIC MCU 16BIT 4KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
4KB (4K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
1,678
MSP430F122IPWMSP430F122IPWTexas InstrumentsIC MCU 16BIT 4KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
4KB (4K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
1,983
MSP430F122IPWRMSP430F122IPWRTexas InstrumentsIC MCU 16BIT 4KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
4KB (4K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
931
MSP430F122IRHBRMSP430F122IRHBRTexas InstrumentsIC MCU 16BIT 4KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
4KB (4K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
565
MSP430F122IRHBTMSP430F122IRHBTTexas InstrumentsIC MCU 16BIT 4KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
4KB (4K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
405
N/AMSP430F1232CYTexas InstrumentsIC MCU 16BIT 8KB FLASH DIESALEMicrocontrollersDiesaleN/A–
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
Diesale
Package / Case:
Die
111
MSP430F1232IDWMSP430F1232IDWTexas InstrumentsIC MCU 16BIT 8KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
628
MSP430F1232IDWRMSP430F1232IDWRTexas InstrumentsIC MCU 16BIT 8KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
627
MSP430F1232IPWMSP430F1232IPWTexas InstrumentsIC MCU 16BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
739
MSP430F1232IPWRMSP430F1232IPWRTexas InstrumentsIC MCU 16BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
51
MSP430F1232IRHBRMSP430F1232IRHBRTexas InstrumentsIC MCU 16BIT 8KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,197
MSP430F1232IRHBTMSP430F1232IRHBTTexas InstrumentsIC MCU 16BIT 8KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
664
MSP430F123IDWMSP430F123IDWTexas InstrumentsIC MCU 16BIT 8KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
966
MSP430F123IDWRMSP430F123IDWRTexas InstrumentsIC MCU 16BIT 8KB FLASH 28SOICMicrocontrollers28-SOICN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-SOIC
Package / Case:
28-SOIC (0.295″”, 7.50mm Width)
313
MSP430F123IPWMSP430F123IPWTexas InstrumentsIC MCU 16BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
1,344
MSP430F123IPWRMSP430F123IPWRTexas InstrumentsIC MCU 16BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
692
MSP430F123IPWR-HYDMSP430F123IPWR-HYDTexas InstrumentsIC MCU 16BIT 8KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
8MHz
Connectivity:
SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
22
Program Memory Size:
8KB (8K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
224

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