Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MSP430F2011IRSARMSP430F2011IRSARTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,401
MSP430F2011IRSATMSP430F2011IRSATTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
74
MSP430F2011TNMSP430F2011TNTexas InstrumentsIC MCU 16BIT 2KB FLASH 14DIPMicrocontrollers14-PDIPN/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
14-PDIP
Package / Case:
14-DIP (0.300″”, 7.62mm)
832
MSP430F2011TPWMSP430F2011TPWTexas InstrumentsIC MCU 16BIT 2KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,020
MSP430F2011TPWRMSP430F2011TPWRTexas InstrumentsIC MCU 16BIT 2KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,514
MSP430F2011TRSARMSP430F2011TRSARTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
169
MSP430F2011TRSATMSP430F2011TRSATTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
Slope A/D
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,003
MSP430F2012INMSP430F2012INTexas InstrumentsIC MCU 16BIT 2KB FLASH 14DIPMicrocontrollers14-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
14-PDIP
Package / Case:
14-DIP (0.300″”, 7.62mm)
509
MSP430F2012IPWMSP430F2012IPWTexas InstrumentsIC MCU 16BIT 2KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
552
MSP430F2012IPWRMSP430F2012IPWRTexas InstrumentsIC MCU 16BIT 2KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,806
MSP430F2012IRSARMSP430F2012IRSARTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,930
MSP430F2012IRSATMSP430F2012IRSATTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,447
MSP430F2012TNMSP430F2012TNTexas InstrumentsIC MCU 16BIT 2KB FLASH 14DIPMicrocontrollers14-PDIPN/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
14-PDIP
Package / Case:
14-DIP (0.300″”, 7.62mm)
815
MSP430F2012TPWMSP430F2012TPWTexas InstrumentsIC MCU 16BIT 2KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
213
MSP430F2012TPWRMSP430F2012TPWRTexas InstrumentsIC MCU 16BIT 2KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
383
MSP430F2012TRSARMSP430F2012TRSARTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
329
MSP430F2012TRSATMSP430F2012TRSATTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 105°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
98
N/AMSP430F2013CYTexas InstrumentsMSP430F2013 16-BIT ULTRA-LOW-POWMicrocontrollers14-CDIPN/A0°C ~ 70°C (TA)
Core Processor:
MSP430™
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
External, Internal
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
14-CDIP
Package / Case:
14-CDIP (0.300″”, 7.62mm)
1,276
MSP430F2013INMSP430F2013INTexas InstrumentsIC MCU 16BIT 2KB FLASH 14DIPMicrocontrollers14-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
14-PDIP
Package / Case:
14-DIP (0.300″”, 7.62mm)
629
MSP430F2013IPWMSP430F2013IPWTexas InstrumentsIC MCU 16BIT 2KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8 + 256B)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
175

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