Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MSP430G2113IRHB32RMSP430G2113IRHB32RTexas InstrumentsIC MCU 16BIT 1KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
997
MSP430G2121IN14MSP430G2121IN14Texas InstrumentsIC MCU 16BIT 1KB FLASH 14DIPMicrocontrollers14-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
14-PDIP
Package / Case:
14-DIP (0.300″”, 7.62mm)
314
MSP430G2121IPW14MSP430G2121IPW14Texas InstrumentsIC MCU 16BIT 1KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
209
MSP430G2121IPW14RMSP430G2121IPW14RTexas InstrumentsIC MCU 16BIT 1KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
207
MSP430G2121IRSA16RMSP430G2121IRSA16RTexas InstrumentsIC MCU 16BIT 1KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,299
MSP430G2121IRSA16TMSP430G2121IRSA16TTexas InstrumentsIC MCU 16BIT 1KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
689
MSP430G2121IRSAQ1MSP430G2121IRSAQ1Texas InstrumentsIC MCU 16BIT 1KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,089
MSP430G2131IN14MSP430G2131IN14Texas InstrumentsIC MCU 16BIT 1KB FLASH 14DIPMicrocontrollers14-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
14-PDIP
Package / Case:
14-DIP (0.300″”, 7.62mm)
1,746
MSP430G2131IPW14MSP430G2131IPW14Texas InstrumentsIC MCU 16BIT 1KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
388
MSP430G2131IPW14RMSP430G2131IPW14RTexas InstrumentsIC MCU 16BIT 1KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,135
MSP430G2131IPW4Q1MSP430G2131IPW4Q1Texas InstrumentsIC MCU 16BIT 1KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
173
MSP430G2131IRSA16RMSP430G2131IRSA16RTexas InstrumentsIC MCU 16BIT 1KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,027
MSP430G2131IRSA16TMSP430G2131IRSA16TTexas InstrumentsIC MCU 16BIT 1KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
211
MSP430G2132IN20MSP430G2132IN20Texas InstrumentsIC MCU 16BIT 1KB FLASH 20DIPMicrocontrollers20-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-PDIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,932
MSP430G2132IPW14MSP430G2132IPW14Texas InstrumentsIC MCU 16BIT 1KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,047
MSP430G2132IPW14RMSP430G2132IPW14RTexas InstrumentsIC MCU 16BIT 1KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
1,264
MSP430G2132IPW20MSP430G2132IPW20Texas InstrumentsIC MCU 16BIT 1KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
1,196
MSP430G2132IPW20RMSP430G2132IPW20RTexas InstrumentsIC MCU 16BIT 1KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
566
MSP430G2132IRSA16RMSP430G2132IRSA16RTexas InstrumentsIC MCU 16BIT 1KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,595
MSP430G2132IRSA16TMSP430G2132IRSA16TTexas InstrumentsIC MCU 16BIT 1KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
1KB (1K x 8)
Program Memory Type:
FLASH
RAM Size:
128 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
885

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up