Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MSP430G2252IRSA16RMSP430G2252IRSA16RTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
748
MSP430G2252IRSA16TMSP430G2252IRSA16TTexas InstrumentsIC MCU 16BIT 2KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
1,172
MSP430G2252TDA1N/AMSP430G2252TDA1Texas InstrumentsIC MCU 16BIT 2KB FLASH DIEMicrocontrollersDieN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Die
Package / Case:
Die
973
MSP430G2252TDA2N/AMSP430G2252TDA2Texas InstrumentsIC MCU 16BIT 2KB FLASH DIEMicrocontrollersDieN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
Die
Package / Case:
Die
1,137
MSP430G2253IN20MSP430G2253IN20Texas InstrumentsIC MCU 16BIT 2KB FLASH 20DIPMicrocontrollers20-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-PDIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
716
MSP430G2253IPW20MSP430G2253IPW20Texas InstrumentsIC MCU 16BIT 2KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
332
MSP430G2253IPW20RMSP430G2253IPW20RTexas InstrumentsIC MCU 16BIT 2KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
641
MSP430G2253IPW28MSP430G2253IPW28Texas InstrumentsIC MCU 16BIT 2KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
560
MSP430G2253IPW28RMSP430G2253IPW28RTexas InstrumentsIC MCU 16BIT 2KB FLASH 28TSSOPMicrocontrollers28-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
28-TSSOP
Package / Case:
28-TSSOP (0.173″”, 4.40mm Width)
67
MSP430G2253IRHB32RMSP430G2253IRHB32RTexas InstrumentsIC MCU 16BIT 2KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
1,166
MSP430G2253IRHB32TMSP430G2253IRHB32TTexas InstrumentsIC MCU 16BIT 2KB FLASH 32VQFNMicrocontrollers32-VQFN (5x5)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
24
Program Memory Size:
2KB (2K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-VQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
24
MSP430G2302IN20MSP430G2302IN20Texas InstrumentsIC MCU 16BIT 4KB FLASH 20DIPMicrocontrollers20-PDIPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
20-PDIP
Package / Case:
20-DIP (0.300″”, 7.62mm)
1,321
MSP430G2302IPW14MSP430G2302IPW14Texas InstrumentsIC MCU 16BIT 4KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
529
MSP430G2302IPW14RMSP430G2302IPW14RTexas InstrumentsIC MCU 16BIT 4KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
314
MSP430G2302IPW1EPMSP430G2302IPW1EPTexas InstrumentsIC MCU 16BIT 4KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
868
MSP430G2302IPW1REPMSP430G2302IPW1REPTexas InstrumentsIC MCU 16BIT 4KB FLASH 14TSSOPMicrocontrollers14-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
14-TSSOP
Package / Case:
14-TSSOP (0.173″”, 4.40mm Width)
522
MSP430G2302IPW20MSP430G2302IPW20Texas InstrumentsIC MCU 16BIT 4KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
333
MSP430G2302IPW20RMSP430G2302IPW20RTexas InstrumentsIC MCU 16BIT 4KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
48
MSP430G2302IRSA16RMSP430G2302IRSA16RTexas InstrumentsIC MCU 16BIT 4KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
955
MSP430G2302IRSA16TMSP430G2302IRSA16TTexas InstrumentsIC MCU 16BIT 4KB FLASH 16QFNMicrocontrollers16-QFN (4x4)N/A-40°C ~ 85°C (TA)
Core Processor:
MSP430 CPU16
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SPI, USI
Peripherals:
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O:
10
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
256 x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4×4)
Package / Case:
16-VQFN Exposed Pad
394

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